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Dielectric ceramic surface metallization method and dielectric ceramic element prepared by using same
The invention discloses a dielectric ceramic surface metallization method and a dielectric ceramic element prepared by the method. The method is not limited by the shape of a ceramic component. A ceramic component which is uniform in plating layer and good in binding force with a substrate can be obtained. The insertion loss of the ceramic component is low, and the technical requirements of high-frequency communication signals are met. The cost problem caused by the process of depositing thick silver on a ceramic surface in the prior art is solved. Meanwhile, the binding force between a substrate of the dielectric ceramic element prepared by the method and a metal layer is strong, and the Q value is high.
本发明公开了一种介电陶瓷表面金属化的方法及采用该方法制备的介电陶瓷元件。该方法不受陶瓷构件的形状限制，能得到镀层均匀并且与基底结合力良好的陶瓷构件，并且陶瓷构件的插损低，满足高频通讯信号的技术要求，并且解决了现有技术中使用在陶瓷表面沉积厚银工艺所带来的成本问题。同时采用本方法制备获得的介电陶瓷元件的基底与金属层的结合力强，Q值高。
Dielectric ceramic surface metallization method and dielectric ceramic element prepared by using same
The invention discloses a dielectric ceramic surface metallization method and a dielectric ceramic element prepared by the method. The method is not limited by the shape of a ceramic component. A ceramic component which is uniform in plating layer and good in binding force with a substrate can be obtained. The insertion loss of the ceramic component is low, and the technical requirements of high-frequency communication signals are met. The cost problem caused by the process of depositing thick silver on a ceramic surface in the prior art is solved. Meanwhile, the binding force between a substrate of the dielectric ceramic element prepared by the method and a metal layer is strong, and the Q value is high.
本发明公开了一种介电陶瓷表面金属化的方法及采用该方法制备的介电陶瓷元件。该方法不受陶瓷构件的形状限制，能得到镀层均匀并且与基底结合力良好的陶瓷构件，并且陶瓷构件的插损低，满足高频通讯信号的技术要求，并且解决了现有技术中使用在陶瓷表面沉积厚银工艺所带来的成本问题。同时采用本方法制备获得的介电陶瓷元件的基底与金属层的结合力强，Q值高。
Dielectric ceramic surface metallization method and dielectric ceramic element prepared by using same
一种介电陶瓷表面金属化的方法及采用该方法制备的介电陶瓷元件
HUANG YUANTI (Autor:in) / SHI SHAOXIONG (Autor:in) / LI WEIMING (Autor:in) / GUO ZHIWEI (Autor:in) / YANG YINGXI (Autor:in) / YUAN MINGJUN (Autor:in)
24.12.2021
Patent
Elektronische Ressource
Chinesisch
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