Metal system film layer preparation process for increasing adhesive force between aluminum nitride ceramic and metal layer: Fid-Bau Portal

Metal system film layer preparation process for increasing adhesive force between aluminum nitride ceramic and metal layer

CUI GE / XU JIAN / SUN SHIGANG

Abstract

The invention relates to the technical field of metal system films, in particular to a metal system film preparation process for increasing the adhesive force between aluminum nitride ceramic and a metal layer, the metal system film is performed step by step, and the excellent performance of the metal system film is achieved through a primary annealing process and a secondary annealing process. The adhesive force between the metal system film layer and the ceramic base material is increased, and the electrical property of the metal system film layer is guaranteed. The problems of degolding, bubbling and the like caused by insufficient adhesive force between the ceramic substrate and the metal system film layer in the traditional metal system film layer preparation process are solved.

本发明涉及金属体系膜技术领域，具体涉及是一种增加氮化铝陶瓷与金属层之间粘附力的金属体系膜层制备工艺，通过金属体系膜层分步进行，且分经过一次退火工艺、二次退火工艺两种退火，实现金属体系膜层的优良性能，既增加了金属体系膜层与陶瓷基材之间的附着力，又保证了金属体系膜层的电学性能。解决了传统的金属体系膜层制备工艺中会存在因为陶瓷基片与金属体系膜层的粘附力不够而产生一些脱金、鼓泡等问题。

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