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The invention provides a shell assembly, a preparation method thereof and electronic equipment. The shell assembly comprises a first base material and a second base material, wherein the first base material is provided with a first surface; the first substrate is provided with a first surface, the second substrate is provided with a second surface, at least part of the second surface is attached to at least part of the first surface through a porous ceramic layer, the porous ceramic layer is provided with pores, and part of the second substrate is embedded into part of the pores. Therefore, the pores of the porous ceramic layer are filled with one part of the second base material, so that the first base material and the porous ceramic layer can be effectively combined together, good bonding strength is achieved between the first base material and the second base material, and the structural stability of the shell assembly is guaranteed; the first base material and the second base material are ground together, so that the joint between the second base material and the first base material has no segment difference, and a good appearance effect of the shell assembly is ensured.
本申请提供了壳体组件及其制备方法和电子设备。壳体组件包括:第一基材,所述第一基材具有第一表面;第二基材,所述第二基材具有第二表面,所述第二表面的至少部分与所述第一表面的至少部分通过多孔陶瓷层贴合设置,所述多孔陶瓷层具有孔隙,所述第二基材的一部分嵌入到部分的所述孔隙中。由此,通过使得第二基材的一部分填充在多孔陶瓷层的孔隙中,进而可以有效的将第一基材多孔陶瓷层结合在一起,使得第一基材与第二基材之间具有良好的结合强度,以保证壳体组件的结构稳定性,而且,制备过程中,通过对第一基材和第二基材一起研磨加工,可以使得第二基材与第一基材之间的结合处无段差,保证壳体组件良好的外观效果。
The invention provides a shell assembly, a preparation method thereof and electronic equipment. The shell assembly comprises a first base material and a second base material, wherein the first base material is provided with a first surface; the first substrate is provided with a first surface, the second substrate is provided with a second surface, at least part of the second surface is attached to at least part of the first surface through a porous ceramic layer, the porous ceramic layer is provided with pores, and part of the second substrate is embedded into part of the pores. Therefore, the pores of the porous ceramic layer are filled with one part of the second base material, so that the first base material and the porous ceramic layer can be effectively combined together, good bonding strength is achieved between the first base material and the second base material, and the structural stability of the shell assembly is guaranteed; the first base material and the second base material are ground together, so that the joint between the second base material and the first base material has no segment difference, and a good appearance effect of the shell assembly is ensured.
本申请提供了壳体组件及其制备方法和电子设备。壳体组件包括:第一基材,所述第一基材具有第一表面;第二基材,所述第二基材具有第二表面,所述第二表面的至少部分与所述第一表面的至少部分通过多孔陶瓷层贴合设置,所述多孔陶瓷层具有孔隙,所述第二基材的一部分嵌入到部分的所述孔隙中。由此,通过使得第二基材的一部分填充在多孔陶瓷层的孔隙中,进而可以有效的将第一基材多孔陶瓷层结合在一起,使得第一基材与第二基材之间具有良好的结合强度,以保证壳体组件的结构稳定性,而且,制备过程中,通过对第一基材和第二基材一起研磨加工,可以使得第二基材与第一基材之间的结合处无段差,保证壳体组件良好的外观效果。
Shell assembly, preparation method thereof and electronic equipment
壳体组件及其制备方法和电子设备
LI CONG (Autor:in)
06.05.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
/
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
B29C
Formen oder Verbinden von Kunststoffen
,
SHAPING OR JOINING OF PLASTICS
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
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