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Seamless splicing plate and splicing process thereof
The seamless splicing plate comprises a base plate, the two edges of the base plate extend in the first direction, and the other two edges of the base plate extend in the second direction; a shielding film is arranged on the front face of the substrate, the two edges, extending in the first direction, of the shielding film are flush with the edges of the substrate, and the shielding film and the substrate are arranged in a staggered mode in the first direction. The shielding film is arranged on the front face of the base plate in a staggered mode, after the plates are spliced, the shielding film can effectively shield the splicing seam, meanwhile, due to the fact that the area of the shielding part of the shielding film is the same as that of the exposed part of the base plate, the shielding film can achieve the precise positioning effect of splicing, and the splicing efficiency is effectively improved. Moreover, the adopted base plate is provided with the putty layer and the primer layer, the seamless splicing plate can be completed only by applying a layer of paint after splicing is completed, multiple processes such as putty applying, primer applying and finishing paint applying in a traditional process are not needed, and the splicing efficiency can be effectively improved.
本发明公开了一种无缝拼接板材及其拼接工艺,包括基板,所述基板的两条边沿沿第一方向延伸,另两条边沿沿第二方向延伸;所述基板的正面设置有遮挡膜,所述遮挡膜沿第一方向延伸的两条边沿与所述基板的边沿齐平,所述遮挡膜在第一方向上与所述基板错位设置。本发明将遮挡膜错位设置在基板正面,在板材拼接后,遮挡膜能够有效遮挡住拼接缝,同时由于遮挡膜的遮挡部与基板的外露部的面积相同,遮挡膜还能够起到拼接的精准定位作用,有效提高了拼接的效率。并且,本发明所采用的基板为具有腻子层、底漆层的基板,无缝拼接板材在拼接完成后只需要上一层漆即可完工,不需要再如传统工艺中的上腻子、上底漆、上面漆等多道工艺,能够有效提高拼接效率。
Seamless splicing plate and splicing process thereof
The seamless splicing plate comprises a base plate, the two edges of the base plate extend in the first direction, and the other two edges of the base plate extend in the second direction; a shielding film is arranged on the front face of the substrate, the two edges, extending in the first direction, of the shielding film are flush with the edges of the substrate, and the shielding film and the substrate are arranged in a staggered mode in the first direction. The shielding film is arranged on the front face of the base plate in a staggered mode, after the plates are spliced, the shielding film can effectively shield the splicing seam, meanwhile, due to the fact that the area of the shielding part of the shielding film is the same as that of the exposed part of the base plate, the shielding film can achieve the precise positioning effect of splicing, and the splicing efficiency is effectively improved. Moreover, the adopted base plate is provided with the putty layer and the primer layer, the seamless splicing plate can be completed only by applying a layer of paint after splicing is completed, multiple processes such as putty applying, primer applying and finishing paint applying in a traditional process are not needed, and the splicing efficiency can be effectively improved.
本发明公开了一种无缝拼接板材及其拼接工艺,包括基板,所述基板的两条边沿沿第一方向延伸,另两条边沿沿第二方向延伸;所述基板的正面设置有遮挡膜,所述遮挡膜沿第一方向延伸的两条边沿与所述基板的边沿齐平,所述遮挡膜在第一方向上与所述基板错位设置。本发明将遮挡膜错位设置在基板正面,在板材拼接后,遮挡膜能够有效遮挡住拼接缝,同时由于遮挡膜的遮挡部与基板的外露部的面积相同,遮挡膜还能够起到拼接的精准定位作用,有效提高了拼接的效率。并且,本发明所采用的基板为具有腻子层、底漆层的基板,无缝拼接板材在拼接完成后只需要上一层漆即可完工,不需要再如传统工艺中的上腻子、上底漆、上面漆等多道工艺,能够有效提高拼接效率。
Seamless splicing plate and splicing process thereof
一种无缝拼接板材及其拼接工艺
LIANG BAOWEI (Autor:in)
13.05.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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