Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Circuit board, bonded body, and method for manufacturing circuit board and bonded body
Provided is a circuit board in which a ceramic substrate and a metal wiring board are joined via a solder layer containing silver, the circuit board being characterized in that the average value of KAM values of a silver portion in the solder layer as determined by the EBSP method is 0.55 DEG or less. Provided is a bonded body in which a ceramic substrate and a metal plate are bonded with a solder layer containing silver interposed therebetween, the bonded body being characterized in that the average value of the KAM values of the silver portion in the solder layer as determined by the EBSP method is 0.55 DEG or less.
本发明提供电路基板，其为陶瓷基板与金属电路板隔着包含银的钎料层接合的电路基板，其中，通过EBSP法求出的上述钎料层中的银部的KAM值的平均值为0.55°以下。本发明提供接合体，其为陶瓷基板与金属板隔着包含银的钎料层接合的接合体，其中，通过EBSP法求出的钎料层中的银部的KAM值的平均值为0.55°以下。
Circuit board, bonded body, and method for manufacturing circuit board and bonded body
Provided is a circuit board in which a ceramic substrate and a metal wiring board are joined via a solder layer containing silver, the circuit board being characterized in that the average value of KAM values of a silver portion in the solder layer as determined by the EBSP method is 0.55 DEG or less. Provided is a bonded body in which a ceramic substrate and a metal plate are bonded with a solder layer containing silver interposed therebetween, the bonded body being characterized in that the average value of the KAM values of the silver portion in the solder layer as determined by the EBSP method is 0.55 DEG or less.
本发明提供电路基板，其为陶瓷基板与金属电路板隔着包含银的钎料层接合的电路基板，其中，通过EBSP法求出的上述钎料层中的银部的KAM值的平均值为0.55°以下。本发明提供接合体，其为陶瓷基板与金属板隔着包含银的钎料层接合的接合体，其中，通过EBSP法求出的钎料层中的银部的KAM值的平均值为0.55°以下。
Circuit board, bonded body, and method for manufacturing circuit board and bonded body
电路基板、接合体以及它们的制造方法
YUASA AKIMASA (Autor:in) / NAKAMURA TAKAHIRO (Autor:in) / EJIMA YOSHIYUKI (Autor:in) / KOBASHI SEIJI (Autor:in) / NISHIMURA KOJI (Autor:in)
19.08.2022
Patent
Elektronische Ressource
Chinesisch
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