Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER-CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER-CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATING CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide: a copper-ceramic bonded body in which a copper member and a ceramic member are bonded reliably and which is excellent in migration resistance; an insulating circuit board; a method for manufacturing the copper-ceramic bonded body; and a method for manufacturing the insulating circuit board.SOLUTION: This invention relates to a copper-ceramic bonded body obtained by bonding a copper member 22 consisting of copper or a copper alloy with a ceramic member 11 consisting of aluminum nitride or silicon nitride. An active metal nitride layer 31 is formed on a side of the ceramic member 11 between the copper member 22 and the ceramic member 11, the nitride layer comprising nitrides of one or more active metals selected from Ti, Zr, Nb; Hf and an Mg-dissolved layer 32 is formed between the active nitride layer 31 and the copper member 22, which is obtained by dissolving Mg in a host phase of Cu; and an active metal is present in the Mg-dissolved layer 32. An insulating circuit board is formed with the copper-ceramic bonded body.SELECTED DRAWING: Figure 2
【課題】銅部材とセラミックス部材とが確実に接合され、耐マイグレーション性に優れた銅／セラミックス接合体、絶縁回路基板、及び、上述の銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材２２と、窒化アルミニウム又は窒化ケイ素からなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材２２とセラミックス部材１１との間においては、セラミックス部材１１側に、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の窒化物からなる活性金属窒化物層３１が形成され、この活性金属窒化物層３１と銅部材２２との間にＣｕの母相中にＭｇが固溶したＭｇ固溶層３２が形成されており、Ｍｇ固溶層３２には、活性金属が存在する。及び、該銅／セラミックス接合体からなる絶縁回路基板。【選択図】図２
COPPER-CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER-CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATING CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide: a copper-ceramic bonded body in which a copper member and a ceramic member are bonded reliably and which is excellent in migration resistance; an insulating circuit board; a method for manufacturing the copper-ceramic bonded body; and a method for manufacturing the insulating circuit board.SOLUTION: This invention relates to a copper-ceramic bonded body obtained by bonding a copper member 22 consisting of copper or a copper alloy with a ceramic member 11 consisting of aluminum nitride or silicon nitride. An active metal nitride layer 31 is formed on a side of the ceramic member 11 between the copper member 22 and the ceramic member 11, the nitride layer comprising nitrides of one or more active metals selected from Ti, Zr, Nb; Hf and an Mg-dissolved layer 32 is formed between the active nitride layer 31 and the copper member 22, which is obtained by dissolving Mg in a host phase of Cu; and an active metal is present in the Mg-dissolved layer 32. An insulating circuit board is formed with the copper-ceramic bonded body.SELECTED DRAWING: Figure 2
【課題】銅部材とセラミックス部材とが確実に接合され、耐マイグレーション性に優れた銅／セラミックス接合体、絶縁回路基板、及び、上述の銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材２２と、窒化アルミニウム又は窒化ケイ素からなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材２２とセラミックス部材１１との間においては、セラミックス部材１１側に、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の窒化物からなる活性金属窒化物層３１が形成され、この活性金属窒化物層３１と銅部材２２との間にＣｕの母相中にＭｇが固溶したＭｇ固溶層３２が形成されており、Ｍｇ固溶層３２には、活性金属が存在する。及び、該銅／セラミックス接合体からなる絶縁回路基板。【選択図】図２
COPPER-CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER-CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATING CIRCUIT BOARD
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (Autor:in)
13.09.2018
Patent
Elektronische Ressource
Japanisch
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