Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Glue discharging method of electronic ceramic green body
The invention discloses a glue discharging method of an electronic ceramic green body, relates to the field of semiconductor processing, and aims to solve the problem that glue discharging of a ceramic substrate is not thorough in the prior art. According to the technical scheme, the glue discharging method is characterized in that CO2 atmosphere is introduced, after 1-2 h, the temperature is raised to 200-220 DEG C in the CO2 atmosphere, the temperature raising rate is 0.4 DEG C/min, and the temperature is kept for 50-100 min at the temperature of 200-220 DEG C; the oxygen concentration ranges from 20 ppm to 200 ppm; s3) low-flow glue discharging; s4) low-speed heating and rubber discharging, and S5) mixed atmosphere cooling and rubber discharging: the temperature is gradually reduced to 400-450 DEG C from 500-550 DEG C, the cooling speed is 0.6 DEG C/min-2 DEG C/min, preheated air is introduced during the period, and the temperature of the preheated air is about 100 DEG C lower than the temperature in the furnace; the flow rate is 60 L/min to 300 L/min. The temperature is kept at 400-450 DEG C for 2-5 h, the temperature is gradually reduced to the normal temperature, the cooling rate is 0.5 DEG C/min-5 DEG C/min, the flow after air preheating is 20-100 L/min, and the blank is taken out, and the blank is taken out after glue discharging is completed. The glue discharging method for the electronic ceramic blank is simple in process, small in residual carbon content during glue discharging and low in cost.
本发明公开了一种电子陶瓷坯体的排胶方法，涉及半导体加工领域，旨在解决现在技术对陶瓷基板排胶不彻底的问题，其技术方案要点是：先通入CO2气氛,1h‑2h之后，在CO2气氛中升温至200℃‑220℃，升温速率0.4℃/min,200℃‑220℃保温时间为50‑100min；氧气浓度为20ppm‑200ppm；S3)低流量排胶；S4)低速升温排胶，S5)混合气氛降温排胶：将温度从500℃‑550℃逐步降温至400℃‑450℃，降温速度为0.6℃/min‑2℃/min,期间将预热的空气通入，预热的空气温度低于炉内温度100℃左右；流量为60L/min‑300L/min。S6）空气气氛排胶：在400℃‑450℃保温2h‑5h，逐渐降温至常温，降温速率为0.5℃/min‑5℃/min，空气预热后流量为20L/min‑100L/min；S7):取出坯体：排胶完成取出坯体。本发明的一种电子陶瓷坯体的排胶方法工艺简单，排胶残碳量少，成本低廉。
Glue discharging method of electronic ceramic green body
The invention discloses a glue discharging method of an electronic ceramic green body, relates to the field of semiconductor processing, and aims to solve the problem that glue discharging of a ceramic substrate is not thorough in the prior art. According to the technical scheme, the glue discharging method is characterized in that CO2 atmosphere is introduced, after 1-2 h, the temperature is raised to 200-220 DEG C in the CO2 atmosphere, the temperature raising rate is 0.4 DEG C/min, and the temperature is kept for 50-100 min at the temperature of 200-220 DEG C; the oxygen concentration ranges from 20 ppm to 200 ppm; s3) low-flow glue discharging; s4) low-speed heating and rubber discharging, and S5) mixed atmosphere cooling and rubber discharging: the temperature is gradually reduced to 400-450 DEG C from 500-550 DEG C, the cooling speed is 0.6 DEG C/min-2 DEG C/min, preheated air is introduced during the period, and the temperature of the preheated air is about 100 DEG C lower than the temperature in the furnace; the flow rate is 60 L/min to 300 L/min. The temperature is kept at 400-450 DEG C for 2-5 h, the temperature is gradually reduced to the normal temperature, the cooling rate is 0.5 DEG C/min-5 DEG C/min, the flow after air preheating is 20-100 L/min, and the blank is taken out, and the blank is taken out after glue discharging is completed. The glue discharging method for the electronic ceramic blank is simple in process, small in residual carbon content during glue discharging and low in cost.
本发明公开了一种电子陶瓷坯体的排胶方法，涉及半导体加工领域，旨在解决现在技术对陶瓷基板排胶不彻底的问题，其技术方案要点是：先通入CO2气氛,1h‑2h之后，在CO2气氛中升温至200℃‑220℃，升温速率0.4℃/min,200℃‑220℃保温时间为50‑100min；氧气浓度为20ppm‑200ppm；S3)低流量排胶；S4)低速升温排胶，S5)混合气氛降温排胶：将温度从500℃‑550℃逐步降温至400℃‑450℃，降温速度为0.6℃/min‑2℃/min,期间将预热的空气通入，预热的空气温度低于炉内温度100℃左右；流量为60L/min‑300L/min。S6）空气气氛排胶：在400℃‑450℃保温2h‑5h，逐渐降温至常温，降温速率为0.5℃/min‑5℃/min，空气预热后流量为20L/min‑100L/min；S7):取出坯体：排胶完成取出坯体。本发明的一种电子陶瓷坯体的排胶方法工艺简单，排胶残碳量少，成本低廉。
Glue discharging method of electronic ceramic green body
一种电子陶瓷坯体的排胶方法
WANG BIN (Autor:in) / HE XIANHAN (Autor:in) / GE ZHUANG (Autor:in) / HE JINGYU (Autor:in) / CUI MENGDE (Autor:in) / SHEN JIAWEI (Autor:in) / DING YINGYING (Autor:in)
01.11.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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