Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Method for quickly discharging PVB (polyvinyl butyral) glue from ceramic body
The invention discloses a method for quickly discharging PVB (polyvinyl butyral) glue from a ceramic green body, relates to semiconductor processing, and aims to solve the problem that the existing glue discharging process is not thorough, and the key point of the technical scheme is as follows: S1) pre-pressing the green body; s2) green body powder coating and stacking; s3) microwave glue discharging: putting the blank into a microwave glue discharging furnace, vacuumizing to-0.095 MPa, continuously increasing the sintering power at an incident power gradient of 25 mA/min, heating the internal surface-mounted electronic element blank to 400 DEG C at a heating rate of 10-40 DEG C/min, then preserving heat at 400 DEG C for 4 hours, and performing glue discharging treatment; s4) discharging glue with air: introducing preheated air, heating through short-wave infrared light at the same time, raising the temperature to 450 DEG C at the temperature raising rate of 5 DEG C/min, preserving the heat for 20-60 minutes when raising the temperature to 50-60 DEG C at the temperature raising rate of 0.4-0.6 DEG C/min, and raising the temperature to 600 DEG C; and S5) cooling and glue discharging: gradually reducing the temperature from 600 DEG C to 200 DEG C at a cooling speed of 2 DEG C/min. According to the method for rapidly discharging the PVB glue from the ceramic body, the glue discharging is thorough, and the time is short.
本发明公开了一种陶瓷坯体快速排PVB胶的方法，涉及半导体加工，旨在解决目前排胶工艺不彻底的问题，其技术方案要点是：S1）坯体预压；S2）生坯敷粉、堆叠；S3）微波排胶：将坯体放入微波排胶炉中，抽真空至‑0.095MPa，以25mA/min的入射功率梯度持续增加烧结功率，使内部贴片电子元件坯料以10℃/min～40℃/min的升温速率升温至400℃，然后在400℃保温4h，进行排胶处理；S4）空气排胶：通入预热空气，同时通过短波红外光加热，以5℃/min升温速率，升温至450℃后，以0.4℃/min‑0.6℃/min的升温速率每升温50℃‑60℃保温20min‑60min，升温至600℃；S5）降温排胶：将温度从600℃逐步降温至200℃，降温速度为2℃/min。本发明的一种陶瓷坯体快速排PVB胶的方法，排胶彻底且时间短。
Method for quickly discharging PVB (polyvinyl butyral) glue from ceramic body
The invention discloses a method for quickly discharging PVB (polyvinyl butyral) glue from a ceramic green body, relates to semiconductor processing, and aims to solve the problem that the existing glue discharging process is not thorough, and the key point of the technical scheme is as follows: S1) pre-pressing the green body; s2) green body powder coating and stacking; s3) microwave glue discharging: putting the blank into a microwave glue discharging furnace, vacuumizing to-0.095 MPa, continuously increasing the sintering power at an incident power gradient of 25 mA/min, heating the internal surface-mounted electronic element blank to 400 DEG C at a heating rate of 10-40 DEG C/min, then preserving heat at 400 DEG C for 4 hours, and performing glue discharging treatment; s4) discharging glue with air: introducing preheated air, heating through short-wave infrared light at the same time, raising the temperature to 450 DEG C at the temperature raising rate of 5 DEG C/min, preserving the heat for 20-60 minutes when raising the temperature to 50-60 DEG C at the temperature raising rate of 0.4-0.6 DEG C/min, and raising the temperature to 600 DEG C; and S5) cooling and glue discharging: gradually reducing the temperature from 600 DEG C to 200 DEG C at a cooling speed of 2 DEG C/min. According to the method for rapidly discharging the PVB glue from the ceramic body, the glue discharging is thorough, and the time is short.
本发明公开了一种陶瓷坯体快速排PVB胶的方法，涉及半导体加工，旨在解决目前排胶工艺不彻底的问题，其技术方案要点是：S1）坯体预压；S2）生坯敷粉、堆叠；S3）微波排胶：将坯体放入微波排胶炉中，抽真空至‑0.095MPa，以25mA/min的入射功率梯度持续增加烧结功率，使内部贴片电子元件坯料以10℃/min～40℃/min的升温速率升温至400℃，然后在400℃保温4h，进行排胶处理；S4）空气排胶：通入预热空气，同时通过短波红外光加热，以5℃/min升温速率，升温至450℃后，以0.4℃/min‑0.6℃/min的升温速率每升温50℃‑60℃保温20min‑60min，升温至600℃；S5）降温排胶：将温度从600℃逐步降温至200℃，降温速度为2℃/min。本发明的一种陶瓷坯体快速排PVB胶的方法，排胶彻底且时间短。
Method for quickly discharging PVB (polyvinyl butyral) glue from ceramic body
一种陶瓷坯体快速排PVB胶的方法
GE ZHUANG (Autor:in) / HE XIANHAN (Autor:in) / CUI MENGDE (Autor:in) / WANG BIN (Autor:in) / DING YINGYING (Autor:in)
11.11.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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