Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Backfill method for tamping-free self-backflow backfill soil of waterproof construction foundation pit
The invention relates to a waterproof construction foundation pit tamping-free self-backflow backfill soil backfilling method which comprises the following steps: step 1, waterproof layer construction: waterproof layer construction is performed in a foundation pit, and sundries in the foundation pit are cleaned up after construction is completed; 2, backfilling is conducted, specifically, the tamping-free self-backflow backfill soil is poured in multiple times in a pumping or self-flowing mode to form multiple backfill soil layers, and after the lower backfill soil layers are solidified layer by layer, pouring of the adjacent upper backfill soil layers can be conducted; the thickness of the bottom layer backfill soil layer formed through first pouring needs to be smaller than 0.6 m, and the thickness of the other backfill soil layers needs to be smaller than 2.5 m; and 3, film covering and curing are conducted, specifically, after foundation pit pouring is completed, film covering is conducted, and the curing time is at least 5 days. The problem that the waterproof layer is cracked due to settlement of the backfilled soil is effectively avoided, the construction procedure of the heat preservation plate in the waterproof construction process is omitted, and the construction efficiency is improved.
本发明涉及一种防水施工基坑免夯实自回流回填土的回填方法，包括如下步骤：步骤1、防水层施工：在基坑内进行防水层施工，施工完毕后将基坑内的杂物清理干净；步骤2、回填：将免夯实自回流回填土采用泵送或自流的方式分多次浇筑形成多层回填土层，待下层回填土层层固化后，即可进行相邻上层的回填土层的浇筑；首次浇筑形成的底层回填土层的厚度需小于0.6m，其余回填土层的厚度需小于2.5m；步骤3、覆膜养护：基坑浇筑完成后，覆盖薄膜，养护时间至少5天。本发明不仅有效避免了防水层由于回填土沉降导致的拉裂问题，还节省了防水施工过程中的保温板施工工序，提高了施工效率。
Backfill method for tamping-free self-backflow backfill soil of waterproof construction foundation pit
The invention relates to a waterproof construction foundation pit tamping-free self-backflow backfill soil backfilling method which comprises the following steps: step 1, waterproof layer construction: waterproof layer construction is performed in a foundation pit, and sundries in the foundation pit are cleaned up after construction is completed; 2, backfilling is conducted, specifically, the tamping-free self-backflow backfill soil is poured in multiple times in a pumping or self-flowing mode to form multiple backfill soil layers, and after the lower backfill soil layers are solidified layer by layer, pouring of the adjacent upper backfill soil layers can be conducted; the thickness of the bottom layer backfill soil layer formed through first pouring needs to be smaller than 0.6 m, and the thickness of the other backfill soil layers needs to be smaller than 2.5 m; and 3, film covering and curing are conducted, specifically, after foundation pit pouring is completed, film covering is conducted, and the curing time is at least 5 days. The problem that the waterproof layer is cracked due to settlement of the backfilled soil is effectively avoided, the construction procedure of the heat preservation plate in the waterproof construction process is omitted, and the construction efficiency is improved.
本发明涉及一种防水施工基坑免夯实自回流回填土的回填方法，包括如下步骤：步骤1、防水层施工：在基坑内进行防水层施工，施工完毕后将基坑内的杂物清理干净；步骤2、回填：将免夯实自回流回填土采用泵送或自流的方式分多次浇筑形成多层回填土层，待下层回填土层层固化后，即可进行相邻上层的回填土层的浇筑；首次浇筑形成的底层回填土层的厚度需小于0.6m，其余回填土层的厚度需小于2.5m；步骤3、覆膜养护：基坑浇筑完成后，覆盖薄膜，养护时间至少5天。本发明不仅有效避免了防水层由于回填土沉降导致的拉裂问题，还节省了防水施工过程中的保温板施工工序，提高了施工效率。
Backfill method for tamping-free self-backflow backfill soil of waterproof construction foundation pit
一种防水施工基坑免夯实自回流回填土的回填方法
BI XINLEI (Autor:in) / XIONG WEI (Autor:in) / ZHANG SHUO (Autor:in) / PENG FANGLING (Autor:in) / XIE CHUANYING (Autor:in) / SHANG ZHENHUA (Autor:in) / NIU FENG (Autor:in)
03.02.2023
Patent
Elektronische Ressource
Chinesisch
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