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Selective region chemical plating process based on ceramic substrate
The invention relates to the technical field of ceramic substrate chemical plating, in particular to a selective region chemical plating process based on a ceramic substrate. Carrying out laser coarsening, carrying out physical coarsening and vacuum plating on the surface of the ceramic through laser, carrying out vacuum plating treatment on the coarsened ceramic to obtain a substrate metal layer, carrying out laser cutting, removing unnecessary patterns in the substrate metal layer through laser cutting to obtain a target pattern, obtaining a product, chemically plating copper, nickel and gold, and chemically plating copper, nickel and gold on the product. By means of the steps, pattern metallization of selective areas of the ceramic base material is achieved, and therefore the needed electrical performance is achieved.
本发明涉及陶瓷基材化学镀技术领域,具体涉及一种基于陶瓷基材选择性区域化学镀工艺;激光粗化,通过激光镭射对陶瓷表面进行物理粗化,真空镀,将粗化后的陶瓷进行真空镀处理,获得基底金属层,激光切割,使用激光切割除去基底金属层中不需要的图案,获得目标图形,得到产品,化学镀铜镍金,将产品进行化学镀铜、镍、金,获得对应厚度的金属层,通过上述步骤实现满足陶瓷基材选择性区域的图案金属化,从而实现所需的电气性能。
Selective region chemical plating process based on ceramic substrate
The invention relates to the technical field of ceramic substrate chemical plating, in particular to a selective region chemical plating process based on a ceramic substrate. Carrying out laser coarsening, carrying out physical coarsening and vacuum plating on the surface of the ceramic through laser, carrying out vacuum plating treatment on the coarsened ceramic to obtain a substrate metal layer, carrying out laser cutting, removing unnecessary patterns in the substrate metal layer through laser cutting to obtain a target pattern, obtaining a product, chemically plating copper, nickel and gold, and chemically plating copper, nickel and gold on the product. By means of the steps, pattern metallization of selective areas of the ceramic base material is achieved, and therefore the needed electrical performance is achieved.
本发明涉及陶瓷基材化学镀技术领域,具体涉及一种基于陶瓷基材选择性区域化学镀工艺;激光粗化,通过激光镭射对陶瓷表面进行物理粗化,真空镀,将粗化后的陶瓷进行真空镀处理,获得基底金属层,激光切割,使用激光切割除去基底金属层中不需要的图案,获得目标图形,得到产品,化学镀铜镍金,将产品进行化学镀铜、镍、金,获得对应厚度的金属层,通过上述步骤实现满足陶瓷基材选择性区域的图案金属化,从而实现所需的电气性能。
Selective region chemical plating process based on ceramic substrate
一种基于陶瓷基材选择性区域化学镀工艺
MAO LIJIAN (Autor:in) / MAO LIBIN (Autor:in)
17.03.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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