Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Copper-clad ceramic substrate and nickel plating method
The invention discloses a copper-clad ceramic substrate and a nickel plating method. The nickel plating method comprises the following steps: step 1, cleaning the surface of the copper-clad ceramic substrate; step 2, pasting a protective film on a single surface; 3, chemical nickel plating, wherein the copper-clad ceramic substrate is placed in a 3%-10% dilute sulfuric acid solution to be cleaned for 3-5 min; washing is conducted for 3 min to 5 min in overflow pure water, and ultrasonic cleaning is conducted for 5 min to 10 min through ultrasonic waves; washing in overflow pure water for 3-5 minutes; the method comprises the following steps of: putting a nickel plate into a palladium chloride activating solution, activating for 2-4 minutes, taking out, washing for 5-10 seconds in overflowing pure water, putting into a nickel plating solution, carrying out chemical nickel plating for 30-40 minutes at the temperature of 90-100 DEG C, controlling the pH value of the solution to 4.7-5.2, washing for 3-5 minutes in overflowing pure water after nickel plating, and carrying out ultrasonic cleaning for 5-10 minutes by ultrasonic waves; the protective film is torn off, water on the surface of the protective film is preliminarily removed through gas, and then the protective film is put into a drying oven to be dried at the temperature of 90-100 DEG C for 20-30 min. According to the method, single-side nickel plating is carried out on the thick ceramic plate through a special process, and the copper surface has good weldability, so that welding of the chip and the copper surface of the copper-clad plate is ensured, and the welding void rate is reduced.
本发明公开了一种覆铜陶瓷基板及镀镍方法，包括如下步骤：步骤一、对覆铜陶瓷基板表面清洁；步骤二、单面贴保护膜；步骤三、化学镀镍：覆铜陶瓷基板放置在3％～10％的稀硫酸液中清洗3～5min；在溢流纯水中冲洗3min～5min,在超声波超声清洗5min～10min；在溢流纯水中冲洗3～5min；在放置氯化钯活化液中活化2～4min取出，用溢流纯水中洗5～10s后,放置在镀镍液中进行化学镀镍，时间为30～40mi n，温度为90℃～100℃，溶液PH值控制在4.7～5.2，镀完镍后在溢流纯水中冲洗3min～5min,在超声波超声清洗5min～10min；把保护膜撕去，用气初步去除表面的水，再放入烘箱内烘干，温度为90℃～100℃，时间20min～30min即可。本发明通过特殊的工艺对粗通陶瓷板进行单面镀镍，铜面具有很好的可焊性，从而确保芯片与覆铜板铜面的焊接，降低焊接空洞率。
Copper-clad ceramic substrate and nickel plating method
The invention discloses a copper-clad ceramic substrate and a nickel plating method. The nickel plating method comprises the following steps: step 1, cleaning the surface of the copper-clad ceramic substrate; step 2, pasting a protective film on a single surface; 3, chemical nickel plating, wherein the copper-clad ceramic substrate is placed in a 3%-10% dilute sulfuric acid solution to be cleaned for 3-5 min; washing is conducted for 3 min to 5 min in overflow pure water, and ultrasonic cleaning is conducted for 5 min to 10 min through ultrasonic waves; washing in overflow pure water for 3-5 minutes; the method comprises the following steps of: putting a nickel plate into a palladium chloride activating solution, activating for 2-4 minutes, taking out, washing for 5-10 seconds in overflowing pure water, putting into a nickel plating solution, carrying out chemical nickel plating for 30-40 minutes at the temperature of 90-100 DEG C, controlling the pH value of the solution to 4.7-5.2, washing for 3-5 minutes in overflowing pure water after nickel plating, and carrying out ultrasonic cleaning for 5-10 minutes by ultrasonic waves; the protective film is torn off, water on the surface of the protective film is preliminarily removed through gas, and then the protective film is put into a drying oven to be dried at the temperature of 90-100 DEG C for 20-30 min. According to the method, single-side nickel plating is carried out on the thick ceramic plate through a special process, and the copper surface has good weldability, so that welding of the chip and the copper surface of the copper-clad plate is ensured, and the welding void rate is reduced.
本发明公开了一种覆铜陶瓷基板及镀镍方法，包括如下步骤：步骤一、对覆铜陶瓷基板表面清洁；步骤二、单面贴保护膜；步骤三、化学镀镍：覆铜陶瓷基板放置在3％～10％的稀硫酸液中清洗3～5min；在溢流纯水中冲洗3min～5min,在超声波超声清洗5min～10min；在溢流纯水中冲洗3～5min；在放置氯化钯活化液中活化2～4min取出，用溢流纯水中洗5～10s后,放置在镀镍液中进行化学镀镍，时间为30～40mi n，温度为90℃～100℃，溶液PH值控制在4.7～5.2，镀完镍后在溢流纯水中冲洗3min～5min,在超声波超声清洗5min～10min；把保护膜撕去，用气初步去除表面的水，再放入烘箱内烘干，温度为90℃～100℃，时间20min～30min即可。本发明通过特殊的工艺对粗通陶瓷板进行单面镀镍，铜面具有很好的可焊性，从而确保芯片与覆铜板铜面的焊接，降低焊接空洞率。
Copper-clad ceramic substrate and nickel plating method
一种覆铜陶瓷基板及镀镍方法
HUANG YONGHUI (Autor:in) / YE MINQIANG (Autor:in) / WANG MINAN (Autor:in) / YU CHENGCHENG (Autor:in) / ZHU LIFANG (Autor:in) / XU LIPING (Autor:in)
06.08.2024
Patent
Elektronische Ressource
Chinesisch
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