Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low-thermal-expansion-coefficient glass solder for connecting ceramics, preparation method and connecting method
The invention relates to a low-thermal-expansion-coefficient glass solder for connecting ceramics, a preparation method and a connecting method. The glass solder with the low thermal expansion coefficient comprises the following chemical components in percentage by weight: 1 to 8 percent of Na2O, 30 to 55 percent of B2O3, 1 to 4 percent of Al2O3 and 40 to 60 percent of SiO2, wherein the sum of the mass percentages of the components is 100 percent. The thermal expansion coefficient well matched with the structural ceramic is obtained by regulating and controlling the components of the glass solder, and the connection quality of the ceramic is effectively improved.
本发明涉及一种用于连接陶瓷的低热膨胀系数玻璃焊料、制备方法及连接方法。所述低热膨胀系数玻璃焊料的化学组成包括：1～8wt.％Na2O、30～55wt.％B2O3、1～4wt.％Al2O3和40～60wt.％SiO2，各组分质量百分比之和为100wt.％。本发明通过调控玻璃焊料的组分获得与结构陶瓷非常匹配的热膨胀系数，有效提高了陶瓷的连接质量。
Low-thermal-expansion-coefficient glass solder for connecting ceramics, preparation method and connecting method
The invention relates to a low-thermal-expansion-coefficient glass solder for connecting ceramics, a preparation method and a connecting method. The glass solder with the low thermal expansion coefficient comprises the following chemical components in percentage by weight: 1 to 8 percent of Na2O, 30 to 55 percent of B2O3, 1 to 4 percent of Al2O3 and 40 to 60 percent of SiO2, wherein the sum of the mass percentages of the components is 100 percent. The thermal expansion coefficient well matched with the structural ceramic is obtained by regulating and controlling the components of the glass solder, and the connection quality of the ceramic is effectively improved.
本发明涉及一种用于连接陶瓷的低热膨胀系数玻璃焊料、制备方法及连接方法。所述低热膨胀系数玻璃焊料的化学组成包括：1～8wt.％Na2O、30～55wt.％B2O3、1～4wt.％Al2O3和40～60wt.％SiO2，各组分质量百分比之和为100wt.％。本发明通过调控玻璃焊料的组分获得与结构陶瓷非常匹配的热膨胀系数，有效提高了陶瓷的连接质量。
Low-thermal-expansion-coefficient glass solder for connecting ceramics, preparation method and connecting method
用于连接陶瓷的低热膨胀系数玻璃焊料、制备方法及连接方法
LIU YAN (Autor:in) / PAN ZIHAO (Autor:in) / WANG BO (Autor:in) / ZHANG HUI (Autor:in) / LIU XUEJIAN (Autor:in) / HUANG ZHENGREN (Autor:in)
10.11.2023
Patent
Elektronische Ressource
Chinesisch
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