Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microcrystalline glass solder and preparation method thereof, and method for connecting aluminum oxide ceramics
The invention discloses a microcrystalline glass solder. The microcrystalline glass solder comprises the following chemical components in percentage by weight: 15 to 20 percent of CaO, 10 to 25 percent of Al2O3, 50 to 55 percent of SiO2, 5 to 10 percent of ZnO and 5 to 10 percent of B2O3. The glass thermal expansion coefficient of the microcrystalline glass solder at 25-700 DEG C is 5.9 * 10<-6>/DEG C-6.5 * 10<-6>/DEG C. In addition, the invention further discloses a preparation method of the microcrystalline glass solder and a method for connecting aluminum oxide ceramics. The thermal expansion coefficient of the microcrystalline glass solder is matched with the thermal expansion of an aluminum oxide ceramic base material; and the microcrystalline glass solder has a proper connection temperature, so low-temperature aluminum oxide ceramic connection is realized, the technological difficulty of aluminum oxide ceramic connection is reduced, the room-temperature strength of a joint is improved, defects such as pores and cracks are avoided, and the connection quality of aluminum oxide ceramic is effectively improved.
本发明公开了一种微晶玻璃焊料，其化学组成为CaO 15～20wt％、Al2O3 10～25wt％、SiO2 50～55wt％、ZnO 5～10wt％、B2O3 5～10wt％；所述微晶玻璃焊料在25～700℃之间的玻璃热膨胀系数为5.9～6.5×10‑6/℃。此外，还公开了上述微晶玻璃焊料的制备方法和连接氧化铝陶瓷的方法。本发明微晶玻璃焊料与氧化铝陶瓷母材热膨胀系数相匹配、且具有适宜的连接温度，从而实现低温连接氧化铝陶瓷，降低了氧化铝陶瓷连接的工艺难度，并且提高了接头室温强度，无气孔裂纹等缺陷，有效提高了氧化铝陶瓷的连接质量。
Microcrystalline glass solder and preparation method thereof, and method for connecting aluminum oxide ceramics
The invention discloses a microcrystalline glass solder. The microcrystalline glass solder comprises the following chemical components in percentage by weight: 15 to 20 percent of CaO, 10 to 25 percent of Al2O3, 50 to 55 percent of SiO2, 5 to 10 percent of ZnO and 5 to 10 percent of B2O3. The glass thermal expansion coefficient of the microcrystalline glass solder at 25-700 DEG C is 5.9 * 10<-6>/DEG C-6.5 * 10<-6>/DEG C. In addition, the invention further discloses a preparation method of the microcrystalline glass solder and a method for connecting aluminum oxide ceramics. The thermal expansion coefficient of the microcrystalline glass solder is matched with the thermal expansion of an aluminum oxide ceramic base material; and the microcrystalline glass solder has a proper connection temperature, so low-temperature aluminum oxide ceramic connection is realized, the technological difficulty of aluminum oxide ceramic connection is reduced, the room-temperature strength of a joint is improved, defects such as pores and cracks are avoided, and the connection quality of aluminum oxide ceramic is effectively improved.
本发明公开了一种微晶玻璃焊料，其化学组成为CaO 15～20wt％、Al2O3 10～25wt％、SiO2 50～55wt％、ZnO 5～10wt％、B2O3 5～10wt％；所述微晶玻璃焊料在25～700℃之间的玻璃热膨胀系数为5.9～6.5×10‑6/℃。此外，还公开了上述微晶玻璃焊料的制备方法和连接氧化铝陶瓷的方法。本发明微晶玻璃焊料与氧化铝陶瓷母材热膨胀系数相匹配、且具有适宜的连接温度，从而实现低温连接氧化铝陶瓷，降低了氧化铝陶瓷连接的工艺难度，并且提高了接头室温强度，无气孔裂纹等缺陷，有效提高了氧化铝陶瓷的连接质量。
Microcrystalline glass solder and preparation method thereof, and method for connecting aluminum oxide ceramics
一种微晶玻璃焊料及其制备方法和连接氧化铝陶瓷的方法
LI KAI (Autor:in) / WAN DETIAN (Autor:in) / LI YUEMING (Autor:in) / LIU YANAN (Autor:in) / ZHENG WEIJUN (Autor:in) / ZHOU JIE (Autor:in) / ZHOU YUDAN (Autor:in) / SU YAQIN (Autor:in)
16.07.2021
Patent
Elektronische Ressource
Chinesisch
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