Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Method for manufacturing nitride ceramic copper-clad plate through low-temperature brazing
The invention belongs to the field of ceramic copper-clad plate preparation, and particularly relates to a method for manufacturing a nitride ceramic copper-clad plate through low-temperature brazing, which comprises the following steps of: 1, cleaning the surfaces of a nitride ceramic substrate and a copper foil; secondly, Ti is sputtered on the surface of the nitride ceramic substrate treated in the first step; (3) Cu is sputtered on the nitride ceramic substrate which is obtained in the step (2) and is sputtered with the Ti layer; 4, printing CuP slurry on the nitride ceramic substrate on which the Cu layer is sputtered, and putting the nitride ceramic substrate on which the CuP slurry is printed into a drying box to dry the CuP slurry; and 5, clamping the nitride ceramic substrate obtained in the step 4 and the cleaned copper foil obtained in the step 1, putting the clamped nitride ceramic substrate and the cleaned copper foil into a vacuum furnace, and performing brazing forming at a relatively low temperature to obtain the nitride ceramic copper-clad plate. And the CuP slurry is adopted, so that Ti and Cu are facilitated to form atomic diffusion at a connection interface at a relatively low temperature, interface bonding is promoted, and the brazing temperature of the ceramic copper-clad plate is further reduced.
本发明属于陶瓷覆铜板制备领域，具体涉及一种通过低温钎焊制作氮化物陶瓷覆铜板的方法，包括以下步骤：步骤一，对氮化物陶瓷基板与铜箔表面进行清洁处理；步骤二，在步骤一处理后的氮化物陶瓷基板表面溅射Ti；步骤三，将步骤二得到的溅射完Ti层的氮化物陶瓷基板上溅射Cu；步骤四，在溅射完Cu层的氮化物陶瓷基板上印刷CuP浆料，并在印刷CuP浆料的氮化物陶瓷基板放入烘干箱中对CuP浆料进行烘干；步骤五，将步骤四得到的氮化物陶瓷基板与步骤一得到的清洗后的铜箔装夹，放入真空炉中，在较低的温度下钎焊成型，得氮化物陶瓷覆铜板；采用CuP浆料，有利于Ti、Cu在较低的温度下在连接界面处形成原子扩散，促进界面结合，进而降低陶瓷覆铜板的钎焊温度。
Method for manufacturing nitride ceramic copper-clad plate through low-temperature brazing
The invention belongs to the field of ceramic copper-clad plate preparation, and particularly relates to a method for manufacturing a nitride ceramic copper-clad plate through low-temperature brazing, which comprises the following steps of: 1, cleaning the surfaces of a nitride ceramic substrate and a copper foil; secondly, Ti is sputtered on the surface of the nitride ceramic substrate treated in the first step; (3) Cu is sputtered on the nitride ceramic substrate which is obtained in the step (2) and is sputtered with the Ti layer; 4, printing CuP slurry on the nitride ceramic substrate on which the Cu layer is sputtered, and putting the nitride ceramic substrate on which the CuP slurry is printed into a drying box to dry the CuP slurry; and 5, clamping the nitride ceramic substrate obtained in the step 4 and the cleaned copper foil obtained in the step 1, putting the clamped nitride ceramic substrate and the cleaned copper foil into a vacuum furnace, and performing brazing forming at a relatively low temperature to obtain the nitride ceramic copper-clad plate. And the CuP slurry is adopted, so that Ti and Cu are facilitated to form atomic diffusion at a connection interface at a relatively low temperature, interface bonding is promoted, and the brazing temperature of the ceramic copper-clad plate is further reduced.
本发明属于陶瓷覆铜板制备领域，具体涉及一种通过低温钎焊制作氮化物陶瓷覆铜板的方法，包括以下步骤：步骤一，对氮化物陶瓷基板与铜箔表面进行清洁处理；步骤二，在步骤一处理后的氮化物陶瓷基板表面溅射Ti；步骤三，将步骤二得到的溅射完Ti层的氮化物陶瓷基板上溅射Cu；步骤四，在溅射完Cu层的氮化物陶瓷基板上印刷CuP浆料，并在印刷CuP浆料的氮化物陶瓷基板放入烘干箱中对CuP浆料进行烘干；步骤五，将步骤四得到的氮化物陶瓷基板与步骤一得到的清洗后的铜箔装夹，放入真空炉中，在较低的温度下钎焊成型，得氮化物陶瓷覆铜板；采用CuP浆料，有利于Ti、Cu在较低的温度下在连接界面处形成原子扩散，促进界面结合，进而降低陶瓷覆铜板的钎焊温度。
Method for manufacturing nitride ceramic copper-clad plate through low-temperature brazing
一种通过低温钎焊制作氮化物陶瓷覆铜板的方法
NING YANGJIN (Autor:in) / HUANG XINGFAN (Autor:in) / FAN XIANGJING (Autor:in) / PAN JIADONG (Autor:in) / ZHANG FENG (Autor:in) / TANG JIANENG (Autor:in) / LIU JIANLIN (Autor:in) / YAN YONG (Autor:in)
02.02.2024
Patent
Elektronische Ressource
Chinesisch
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