Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Pouring mold for ballastless track leveling layer and ballastless track construction method
The invention discloses a pouring mold for a ballastless track leveling layer and a ballastless track construction method, and belongs to the technical field of ballastless tracks. The pouring mold comprises a bottom plate, a surrounding plate and an inserting plate. A notch is formed in the edge of the bottom plate, the bottom plate is used for being installed on a lower foundation, the bottom edge of the surrounding plate is perpendicularly connected with the side edge, corresponding to the notch, of the bottom plate, the inner contour of the surrounding plate is used for being attached to the outer contour of each round corner of a prefabricated plate so that the prefabricated plate can be surrounded by the surrounding plate and the mold plates, discharging holes are formed in the surrounding plate, and the inserting plate is movably arranged on the surrounding plate. A plurality of connecting bolts which are arranged at intervals are inserted into the surrounding plate, and the connecting bolts penetrate through the surrounding plate to connect the surrounding plate with the prefabricated plate. According to the pouring mold for the leveling layer of the ballastless track provided by the embodiment of the invention, leakage can be prevented from being formed at each fillet of the prefabricated slab in the grouting process, the pouring quality of the leveling layer can be ensured in the pouring process, and meanwhile, the production cost is reduced.
本发明公开了一种用于无砟轨道调平层的灌注模具及无砟轨道施工方法，属于无砟轨道技术领域。所述灌注模具包括底板、围板和插板；底板的边缘具有缺口，底板用于安装在下部基础上，围板的底边与底板的缺口对应的侧边垂直连接，围板的内轮廓用于与预制板的各圆角的外轮廓相贴合，以与多个模具板围设预制板，围板上上设置有排料孔，插板可活动地布置在围板，以密封排料孔，围板上插装有多个间隔布置的连接螺栓，且各连接螺栓贯穿围板，以连接围板和预制板。本发明实施例提供的一种用于无砟轨道调平层的灌注模具，不仅可以避免预制板的各圆角处在灌浆过程中形成泄露，还能在灌注过程中保证对调平层的灌注质量，同时降低了生产成本。
Pouring mold for ballastless track leveling layer and ballastless track construction method
The invention discloses a pouring mold for a ballastless track leveling layer and a ballastless track construction method, and belongs to the technical field of ballastless tracks. The pouring mold comprises a bottom plate, a surrounding plate and an inserting plate. A notch is formed in the edge of the bottom plate, the bottom plate is used for being installed on a lower foundation, the bottom edge of the surrounding plate is perpendicularly connected with the side edge, corresponding to the notch, of the bottom plate, the inner contour of the surrounding plate is used for being attached to the outer contour of each round corner of a prefabricated plate so that the prefabricated plate can be surrounded by the surrounding plate and the mold plates, discharging holes are formed in the surrounding plate, and the inserting plate is movably arranged on the surrounding plate. A plurality of connecting bolts which are arranged at intervals are inserted into the surrounding plate, and the connecting bolts penetrate through the surrounding plate to connect the surrounding plate with the prefabricated plate. According to the pouring mold for the leveling layer of the ballastless track provided by the embodiment of the invention, leakage can be prevented from being formed at each fillet of the prefabricated slab in the grouting process, the pouring quality of the leveling layer can be ensured in the pouring process, and meanwhile, the production cost is reduced.
本发明公开了一种用于无砟轨道调平层的灌注模具及无砟轨道施工方法，属于无砟轨道技术领域。所述灌注模具包括底板、围板和插板；底板的边缘具有缺口，底板用于安装在下部基础上，围板的底边与底板的缺口对应的侧边垂直连接，围板的内轮廓用于与预制板的各圆角的外轮廓相贴合，以与多个模具板围设预制板，围板上上设置有排料孔，插板可活动地布置在围板，以密封排料孔，围板上插装有多个间隔布置的连接螺栓，且各连接螺栓贯穿围板，以连接围板和预制板。本发明实施例提供的一种用于无砟轨道调平层的灌注模具，不仅可以避免预制板的各圆角处在灌浆过程中形成泄露，还能在灌注过程中保证对调平层的灌注质量，同时降低了生产成本。
Pouring mold for ballastless track leveling layer and ballastless track construction method
一种用于无砟轨道调平层的灌注模具及无砟轨道施工方法
REN XICHONG (Autor:in) / LI QIUYI (Autor:in) / YANG ZHOU (Autor:in) / ZHANG SHIJIE (Autor:in) / ZHANG ZHENG (Autor:in) / YI ZHENGHONG (Autor:in) / ZHANG CHAOYONG (Autor:in) / WANG GUFENG (Autor:in) / SUN LI (Autor:in) / ZHU BIN (Autor:in)
20.02.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
E01B
PERMANENT WAY
,
Gleisoberbau
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