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Aluminum nitride-based copper-clad plate and preparation method thereof
The invention relates to an aluminum nitride-based copper-clad plate and a preparation method thereof. The preparation method comprises the following steps: firstly, carrying out surface oxidation and air plasma treatment on an aluminum nitride-based plate; secondly, spin-coating the surface of the ceramic substrate with ultraviolet reduction active sol containing nano oxide particles by adopting a spin-coating method to obtain an intermediate layer with a controllable microscopic rough morphology, and sintering the ceramic substrate obtained after spin-coating at high temperature to form firm combination between the intermediate layer and the ceramic substrate; and finally, performing ultraviolet catalytic chemical reduction to deposit copper to obtain the aluminum nitride-based copper-clad plate. Compared with the prior art, the method does not need to use a noble metal activator, the roughness of the surface copper-clad layer is uniform and controllable, the binding force between the copper-clad layer and the ceramic substrate is high, and the method has the advantages of simple preparation process, easiness in operation, low raw material cost and the like.
本发明涉及一种氮化铝基覆铜板及其制备方法，其中制备方法包括如下步骤：首先将氮化铝基板进行表面氧化、空气等离子体处理；其次采用旋涂法将含有纳米氧化物颗粒的紫外还原活性溶胶旋涂至陶瓷基板表面获得具有可控微观粗糙形貌的中间层，将旋涂后获得的陶瓷基板进行高温烧结使中间层与陶瓷基板形成牢固结合；最后进行紫外催化化学还原沉积铜，即得到氮化铝基覆铜板。与现有技术相比，本发明无需使用贵金属活化剂，表面覆铜层粗糙度均匀可控，覆铜层与陶瓷基板结合力高，具有制备工艺简单、易于操作、原料成本低廉等优点。
Aluminum nitride-based copper-clad plate and preparation method thereof
The invention relates to an aluminum nitride-based copper-clad plate and a preparation method thereof. The preparation method comprises the following steps: firstly, carrying out surface oxidation and air plasma treatment on an aluminum nitride-based plate; secondly, spin-coating the surface of the ceramic substrate with ultraviolet reduction active sol containing nano oxide particles by adopting a spin-coating method to obtain an intermediate layer with a controllable microscopic rough morphology, and sintering the ceramic substrate obtained after spin-coating at high temperature to form firm combination between the intermediate layer and the ceramic substrate; and finally, performing ultraviolet catalytic chemical reduction to deposit copper to obtain the aluminum nitride-based copper-clad plate. Compared with the prior art, the method does not need to use a noble metal activator, the roughness of the surface copper-clad layer is uniform and controllable, the binding force between the copper-clad layer and the ceramic substrate is high, and the method has the advantages of simple preparation process, easiness in operation, low raw material cost and the like.
本发明涉及一种氮化铝基覆铜板及其制备方法，其中制备方法包括如下步骤：首先将氮化铝基板进行表面氧化、空气等离子体处理；其次采用旋涂法将含有纳米氧化物颗粒的紫外还原活性溶胶旋涂至陶瓷基板表面获得具有可控微观粗糙形貌的中间层，将旋涂后获得的陶瓷基板进行高温烧结使中间层与陶瓷基板形成牢固结合；最后进行紫外催化化学还原沉积铜，即得到氮化铝基覆铜板。与现有技术相比，本发明无需使用贵金属活化剂，表面覆铜层粗糙度均匀可控，覆铜层与陶瓷基板结合力高，具有制备工艺简单、易于操作、原料成本低廉等优点。
Aluminum nitride-based copper-clad plate and preparation method thereof
一种氮化铝基覆铜板及其制备方法
01.03.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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