Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low-temperature co-fired ferrite multilayer wiring substrate slurry, prepared substrate and preparation method
The invention discloses a low-temperature co-fired ferrite multilayer wiring substrate slurry, a prepared substrate and a preparation method, and belongs to the technical field of electronic materials, the slurry comprises ferrite powder, a solvent, a binder, a plasticizer, an auxiliary plasticizer, a dispersant, a surfactant and a phase change agent, the preparation method comprises the steps of ferrite burdening, ferrite mixing and pre-sintering, substrate material slurry manufacturing, film casting, circuit printing, laminating, sintering and the like. By means of the method, the density of the multilayer wiring substrate is improved, the area of the substrate is increased, the number of wiring layers of the substrate is increased, the breaking strength is improved, the warping degree is reduced, and the thermal expansion coefficient is reduced; the prepared multilayer wiring substrate is uniform in shrinkage in the XYZ direction, the breaking strength can reach 117 MPa, the warping degree is smaller than 75/50 microns/mm, and the thermal expansion coefficient is smaller than 10.05 ppm/DEG C.
本发明公开了一种低温共烧铁氧体多层布线基板浆料、制成的基板及制备方法，属于电子材料技术领域，所述浆料组成包括铁氧体粉料、溶剂、粘结剂、增塑剂、辅助增塑剂、分散剂、表面活性剂、相变剂，所述制备方法包括铁氧体配料、铁氧体混料预烧、制作基板材料浆料、流延成膜、印刷电路、叠压及烧结等；通过本发明的方法，提高了多层布线的基板密度，增加基板面积、提高基板布线层数,提高抗折强度,减少翘曲度,降低热膨胀系数；能够保证所制得的多层布线基板在X\Y\Z方向收缩均等,抗折强度可达117 MPa,翘曲度小于75/50μm/mm,热膨胀系数小于10.05 ppm/℃。
Low-temperature co-fired ferrite multilayer wiring substrate slurry, prepared substrate and preparation method
The invention discloses a low-temperature co-fired ferrite multilayer wiring substrate slurry, a prepared substrate and a preparation method, and belongs to the technical field of electronic materials, the slurry comprises ferrite powder, a solvent, a binder, a plasticizer, an auxiliary plasticizer, a dispersant, a surfactant and a phase change agent, the preparation method comprises the steps of ferrite burdening, ferrite mixing and pre-sintering, substrate material slurry manufacturing, film casting, circuit printing, laminating, sintering and the like. By means of the method, the density of the multilayer wiring substrate is improved, the area of the substrate is increased, the number of wiring layers of the substrate is increased, the breaking strength is improved, the warping degree is reduced, and the thermal expansion coefficient is reduced; the prepared multilayer wiring substrate is uniform in shrinkage in the XYZ direction, the breaking strength can reach 117 MPa, the warping degree is smaller than 75/50 microns/mm, and the thermal expansion coefficient is smaller than 10.05 ppm/DEG C.
本发明公开了一种低温共烧铁氧体多层布线基板浆料、制成的基板及制备方法，属于电子材料技术领域，所述浆料组成包括铁氧体粉料、溶剂、粘结剂、增塑剂、辅助增塑剂、分散剂、表面活性剂、相变剂，所述制备方法包括铁氧体配料、铁氧体混料预烧、制作基板材料浆料、流延成膜、印刷电路、叠压及烧结等；通过本发明的方法，提高了多层布线的基板密度，增加基板面积、提高基板布线层数,提高抗折强度,减少翘曲度,降低热膨胀系数；能够保证所制得的多层布线基板在X\Y\Z方向收缩均等,抗折强度可达117 MPa,翘曲度小于75/50μm/mm,热膨胀系数小于10.05 ppm/℃。
Low-temperature co-fired ferrite multilayer wiring substrate slurry, prepared substrate and preparation method
低温共烧铁氧体多层布线基板浆料、制成的基板及制备方法
ZHOU PINGZHANG (Autor:in) / WANG SHENG (Autor:in) / WU WENJIE (Autor:in) / LI XUEMEI (Autor:in) / LI KEYAO (Autor:in) / WU JUN (Autor:in) / ZHANG CHAO (Autor:in) / WAN FEI (Autor:in)
26.03.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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