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Copper-ceramic bonded body and insulated circuit board
The copper-ceramic bonded body (10) is provided with copper members (12, 13) made of copper or a copper alloy and a ceramic member (11), the copper members (12, 13) and the ceramic member (11) are bonded, and an active metal compound layer (21) made of an active metal compound is formed on the ceramic member (11) side at the bonding interface between the ceramic member (11) and the copper members (12, 13). The ceramic member (11) has a microcrack (25) extending from the bonding interface to the inside of the ceramic member (11), and at least a portion of the microcrack (25) is filled with an active metal compound.
该铜‑陶瓷接合体(10)具备由铜或铜合金制成的铜部件(12、13)和陶瓷部件(11),铜部件(12、13)与陶瓷部件(11)接合,在陶瓷部件(11)与铜部件(12、13)的接合界面,在陶瓷部件(11)侧形成有由活性金属化合物制成的活性金属化合物层(21),在陶瓷部件(11)中存在从接合界面向陶瓷部件(11)的内部侧扩展的微裂纹(25),在微裂纹(25)的至少一部分填充有活性金属化合物。
Copper-ceramic bonded body and insulated circuit board
The copper-ceramic bonded body (10) is provided with copper members (12, 13) made of copper or a copper alloy and a ceramic member (11), the copper members (12, 13) and the ceramic member (11) are bonded, and an active metal compound layer (21) made of an active metal compound is formed on the ceramic member (11) side at the bonding interface between the ceramic member (11) and the copper members (12, 13). The ceramic member (11) has a microcrack (25) extending from the bonding interface to the inside of the ceramic member (11), and at least a portion of the microcrack (25) is filled with an active metal compound.
该铜‑陶瓷接合体(10)具备由铜或铜合金制成的铜部件(12、13)和陶瓷部件(11),铜部件(12、13)与陶瓷部件(11)接合,在陶瓷部件(11)与铜部件(12、13)的接合界面,在陶瓷部件(11)侧形成有由活性金属化合物制成的活性金属化合物层(21),在陶瓷部件(11)中存在从接合界面向陶瓷部件(11)的内部侧扩展的微裂纹(25),在微裂纹(25)的至少一部分填充有活性金属化合物。
Copper-ceramic bonded body and insulated circuit board
铜-陶瓷接合体及绝缘电路基板
SAKURAI AKIRA (Autor:in) / TERASAKI NOBUYUKI (Autor:in)
03.05.2024
Patent
Elektronische Ressource
Chinesisch
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