Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
A copper/ceramic bonded body of the present invention is formed by bonding a copper member, which is formed of copper or a copper alloy, and a ceramic member, in which a ratio D1/D0 is 0.60 or less, D0 being an average crystal grain size of the entire copper member, D1 being an average crystal grain size of the copper member at a position 50 µm from a bonding surface with the ceramic member, D0 and D1 being obtained by observing a cross-section of the copper member along a laminating direction.
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
A copper/ceramic bonded body of the present invention is formed by bonding a copper member, which is formed of copper or a copper alloy, and a ceramic member, in which a ratio D1/D0 is 0.60 or less, D0 being an average crystal grain size of the entire copper member, D1 being an average crystal grain size of the copper member at a position 50 µm from a bonding surface with the ceramic member, D0 and D1 being obtained by observing a cross-section of the copper member along a laminating direction.
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
KUPFER/KERAMIK VERBUNDKÖRPER UND ISOLIERTE LEITERPLATTE
CORPS LIÉ EN CUIVRE/CÉRAMIQUE ET CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TAKAKUWA SATOSHI (Autor:in) / TERASAKI NOBUYUKI (Autor:in) / NISHIMOTO SHUJI (Autor:in)
03.07.2024
Patent
Elektronische Ressource
Englisch
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