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Copper-ceramic bonded substrate and method for manufacturing same
This copper-ceramic bonded substrate is provided with: a ceramic substrate; and a copper plate bonded to at least one surface of the ceramic substrate, wherein the dislocation density of the copper plate is 1.5 * 10 < 13 > m <-2 > or less.
本发明提供一种铜‑陶瓷接合基板,其具备:陶瓷基板;及接合于所述陶瓷基板的至少一个面的铜板,所述铜板的位错密度为1.5×1013m‑2以下。
Copper-ceramic bonded substrate and method for manufacturing same
This copper-ceramic bonded substrate is provided with: a ceramic substrate; and a copper plate bonded to at least one surface of the ceramic substrate, wherein the dislocation density of the copper plate is 1.5 * 10 < 13 > m <-2 > or less.
本发明提供一种铜‑陶瓷接合基板,其具备:陶瓷基板;及接合于所述陶瓷基板的至少一个面的铜板,所述铜板的位错密度为1.5×1013m‑2以下。
Copper-ceramic bonded substrate and method for manufacturing same
铜-陶瓷接合基板及其制造方法
YUKI SEIYA (Autor:in) / TERAMOTO YUKI (Autor:in)
01.10.2024
Patent
Elektronische Ressource
Chinesisch
Copper-ceramic bonded substrate and method for manufacturing same
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