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    Copper-ceramic bonded substrate and method for manufacturing same

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    This copper-ceramic bonded substrate is provided with: a ceramic substrate; and a copper plate bonded to at least one surface of the ceramic substrate, wherein the dislocation density of the copper plate is 1.5 * 10 < 13 > m <-2 > or less.

    本发明提供一种铜‑陶瓷接合基板，其具备：陶瓷基板；及接合于所述陶瓷基板的至少一个面的铜板，所述铜板的位错密度为1.5×1013m‑2以下。

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    Copper-ceramic bonded substrate and method for manufacturing same

    New search for: YUKI SEIYA
    New search for: TERAMOTO YUKI

    This copper-ceramic bonded substrate is provided with: a ceramic substrate; and a copper plate bonded to at least one surface of the ceramic substrate, wherein the dislocation density of the copper plate is 1.5 * 10 < 13 > m <-2 > or less.

    本发明提供一种铜‑陶瓷接合基板，其具备：陶瓷基板；及接合于所述陶瓷基板的至少一个面的铜板，所述铜板的位错密度为1.5×1013m‑2以下。

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    Copper-ceramic bonded substrate and method for manufacturing same

    New search for: YUKI SEIYA
    New search for: TERAMOTO YUKI

    This copper-ceramic bonded substrate is provided with: a ceramic substrate; and a copper plate bonded to at least one surface of the ceramic substrate, wherein the dislocation density of the copper plate is 1.5 * 10 < 13 > m <-2 > or less.

    本发明提供一种铜‑陶瓷接合基板，其具备：陶瓷基板；及接合于所述陶瓷基板的至少一个面的铜板，所述铜板的位错密度为1.5×1013m‑2以下。

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    Title:

    Copper-ceramic bonded substrate and method for manufacturing same

    Additional title:

    铜-陶瓷接合基板及其制造方法

    Contributors:

    YUKI SEIYA (author) / TERAMOTO YUKI (author)

    Publication date:

    2024-10-01

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    Chinese

    Classification:

    IPC:  C04B Kalk , LIME / B23K Löten , SOLDERING OR UNSOLDERING / C22C Legierungen , ALLOYS / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen

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