Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low-loss LTCC (Low Temperature Co-Fired Ceramic) with adjustable dielectric constant and preparation method thereof
The embodiment of the invention discloses a low-loss LTCC (Low Temperature Co-Fired Ceramic) with an adjustable dielectric constant and a preparation method thereof, and belongs to the technical field of electronic packaging, and the low-loss LTCC comprises the following raw materials in percentage: 30-70% of glass powder, 20-70% of alpha-Al2O3 powder and 0-10% of quartz powder. The high-temperature-resistant and corrosion-resistant quartz crucible is adopted for melting, a Pt crucible is not used, introduction of Pt impurities is avoided, and dielectric loss is reduced; siO2-B2O3-Al2O3-MgO-ZnO-Li2O-K2O glass powder with a specific formula has good stability, glass is softened during sintering, the overall sintering temperature is reduced through liquid-phase mass transfer, the glass powder and the ceramic powder are co-fired with metal slurry at 900 DEG C by adjusting the ratio of the glass powder to the ceramic powder, and finally the low-loss LTCC ceramic material with the adjustable dielectric constant is obtained, the dielectric constant is 4.4-8.3 (1MHz), the dielectric loss is 3 * 10 <-4 >-9 * 10 <-4 > (1MHz), and the low-loss LTCC ceramic material is suitable for being used as a ceramic material. The material can be used for microwave components such as filters, couplers, LTCC substrates and the like.
本发明实施例公开了一种介电常数可调的低损耗LTCC瓷料及其制备方法，属于电子封装技术领域，所述低损耗LTCC瓷料按百分含量计包括以下原料：玻璃粉30‑70％、α‑Al2O3粉20‑70％、石英粉0‑10％。本发明采用耐高温耐腐蚀石英坩埚熔制，不使用Pt坩埚，避免引入Pt杂质，降低了介电损耗；特定配方的SiO2‑B2O3‑Al2O3‑MgO‑ZnO‑Li2O‑K2O玻璃粉具有很好的稳定性，烧结时玻璃软化，通过液相传质降低整体的烧结温度，通过调整玻璃粉和陶瓷粉的比例，与金属浆料在900℃完成共烧，最终得到介电常数可调的低损耗LTCC瓷料，介电常数4.4‑8.3(1MHz)、介电损耗3×10‑4‑9×10‑4(1MHz)，可用于滤波器、耦合器、LTCC基板等微波元器件。
Low-loss LTCC (Low Temperature Co-Fired Ceramic) with adjustable dielectric constant and preparation method thereof
The embodiment of the invention discloses a low-loss LTCC (Low Temperature Co-Fired Ceramic) with an adjustable dielectric constant and a preparation method thereof, and belongs to the technical field of electronic packaging, and the low-loss LTCC comprises the following raw materials in percentage: 30-70% of glass powder, 20-70% of alpha-Al2O3 powder and 0-10% of quartz powder. The high-temperature-resistant and corrosion-resistant quartz crucible is adopted for melting, a Pt crucible is not used, introduction of Pt impurities is avoided, and dielectric loss is reduced; siO2-B2O3-Al2O3-MgO-ZnO-Li2O-K2O glass powder with a specific formula has good stability, glass is softened during sintering, the overall sintering temperature is reduced through liquid-phase mass transfer, the glass powder and the ceramic powder are co-fired with metal slurry at 900 DEG C by adjusting the ratio of the glass powder to the ceramic powder, and finally the low-loss LTCC ceramic material with the adjustable dielectric constant is obtained, the dielectric constant is 4.4-8.3 (1MHz), the dielectric loss is 3 * 10 <-4 >-9 * 10 <-4 > (1MHz), and the low-loss LTCC ceramic material is suitable for being used as a ceramic material. The material can be used for microwave components such as filters, couplers, LTCC substrates and the like.
本发明实施例公开了一种介电常数可调的低损耗LTCC瓷料及其制备方法，属于电子封装技术领域，所述低损耗LTCC瓷料按百分含量计包括以下原料：玻璃粉30‑70％、α‑Al2O3粉20‑70％、石英粉0‑10％。本发明采用耐高温耐腐蚀石英坩埚熔制，不使用Pt坩埚，避免引入Pt杂质，降低了介电损耗；特定配方的SiO2‑B2O3‑Al2O3‑MgO‑ZnO‑Li2O‑K2O玻璃粉具有很好的稳定性，烧结时玻璃软化，通过液相传质降低整体的烧结温度，通过调整玻璃粉和陶瓷粉的比例，与金属浆料在900℃完成共烧，最终得到介电常数可调的低损耗LTCC瓷料，介电常数4.4‑8.3(1MHz)、介电损耗3×10‑4‑9×10‑4(1MHz)，可用于滤波器、耦合器、LTCC基板等微波元器件。
Low-loss LTCC (Low Temperature Co-Fired Ceramic) with adjustable dielectric constant and preparation method thereof
一种介电常数可调的低损耗LTCC瓷料及其制备方法
XU XIAODIAN (Autor:in) / CHENG HUARONG (Autor:in) / ZHOU HONGPENG (Autor:in) / HE LEI (Autor:in) / GUO MOHAN (Autor:in) / DENG JIANLIN (Autor:in)
29.10.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
/
C03B
Herstellung oder Formgebung von Glas, Mineral- oder Schlackenwolle
,
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
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