Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Method for improving warping of DCB low-thickness product during sintering
The invention relates to the technical field of semiconductor manufacturing, in particular to a method for improving warping of a DCB low-thickness product during sintering, and the method comprises the following steps: 1, bonding a first porcelain strip and a second porcelain strip at the periphery of the surface of a base plate, and then bonding a supporting column at the center point of the base plate to form a sintering jig; step 2, sequentially placing a to-be-sintered ceramic chip and a copper foil in the sintering jig, and carrying out first-surface copper-clad sintering after the placement is completed, so as to obtain a single-surface copper-clad semi-finished product; the thickness of the ceramic chip is less than 0.32 mm; and thirdly, the semi-finished product with the single face coated with the copper in the second step is turned over and then placed in the sintering jig, and after copper foil is placed on the semi-finished product with the single face coated with the copper, second face copper coating sintering is carried out. And the ceramic chip and the copper foil are more uniformly deformed in the heating process, and are not easy to distort at a high temperature to cause ceramic cracks, so that the warping degree of a product is reduced.
本申请涉及半导体制造技术领域，具体涉及一种改善DCB低厚度产品烧结时翘曲的方法，包括以下步骤：步骤一，在垫板的表面四周粘接第一瓷条和第二瓷条，随后在垫板的中心点粘接支撑柱，组成烧结治具；步骤二，将待烧结的瓷片以及铜箔先后依次摆放在所述烧结治具内，摆放完成后进行第一面覆铜烧结，得到单面覆铜半成品；所述瓷片的厚度小于0.32mm；步骤三，将步骤二中单面覆铜半成品翻面后摆放至所述烧结治具内，在所述单面覆铜半成品的上方放置铜箔后，进行第二面覆铜烧结。使瓷片和铜箔在受热过程中变形更为均匀，并且在高温下不易产生扭曲从而造成的瓷裂，降低产品的翘曲度。
Method for improving warping of DCB low-thickness product during sintering
The invention relates to the technical field of semiconductor manufacturing, in particular to a method for improving warping of a DCB low-thickness product during sintering, and the method comprises the following steps: 1, bonding a first porcelain strip and a second porcelain strip at the periphery of the surface of a base plate, and then bonding a supporting column at the center point of the base plate to form a sintering jig; step 2, sequentially placing a to-be-sintered ceramic chip and a copper foil in the sintering jig, and carrying out first-surface copper-clad sintering after the placement is completed, so as to obtain a single-surface copper-clad semi-finished product; the thickness of the ceramic chip is less than 0.32 mm; and thirdly, the semi-finished product with the single face coated with the copper in the second step is turned over and then placed in the sintering jig, and after copper foil is placed on the semi-finished product with the single face coated with the copper, second face copper coating sintering is carried out. And the ceramic chip and the copper foil are more uniformly deformed in the heating process, and are not easy to distort at a high temperature to cause ceramic cracks, so that the warping degree of a product is reduced.
本申请涉及半导体制造技术领域，具体涉及一种改善DCB低厚度产品烧结时翘曲的方法，包括以下步骤：步骤一，在垫板的表面四周粘接第一瓷条和第二瓷条，随后在垫板的中心点粘接支撑柱，组成烧结治具；步骤二，将待烧结的瓷片以及铜箔先后依次摆放在所述烧结治具内，摆放完成后进行第一面覆铜烧结，得到单面覆铜半成品；所述瓷片的厚度小于0.32mm；步骤三，将步骤二中单面覆铜半成品翻面后摆放至所述烧结治具内，在所述单面覆铜半成品的上方放置铜箔后，进行第二面覆铜烧结。使瓷片和铜箔在受热过程中变形更为均匀，并且在高温下不易产生扭曲从而造成的瓷裂，降低产品的翘曲度。
Method for improving warping of DCB low-thickness product during sintering
一种改善DCB低厚度产品烧结时翘曲的方法
DING QIN (Autor:in) / WAN HAOJIE (Autor:in) / WANG YIQIANG (Autor:in) / SHUAI HAO (Autor:in) / TU FENGWEN (Autor:in) / XU QING (Autor:in) / HU LIN (Autor:in) / YANG SHIBING (Autor:in)
03.12.2024
Patent
Elektronische Ressource
Chinesisch
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