Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Method for improving warping of copper-clad ceramic substrate mother board
The invention discloses a method for improving warping of a copper-clad ceramic substrate mother board. Comprising a ceramic substrate, a solder layer and copper foils, the copper foils are brazed on the two sides of the ceramic substrate through the solder layer, the ceramic substrate is one or more of aluminum oxide, aluminum nitride and silicon nitride, graphene oxide is subjected to surface treatment, the interfacial compatibility is improved, hollow glass beads and titanium dioxide are added and mixed with a nickel plating solution, and the nickel plating solution is prepared. Nickel plating treatment is carried out on the surface of the ceramic substrate, the mechanical property of a ceramic substrate template is improved, solder patterns of different sizes are designed on the two sides of the ceramic substrate, and the bonding area of copper foils on the two sides and ceramic is adjusted, so that contraction force borne by the two sides of the ceramic substrate is consistent when the ceramic substrate is cooled; the problem that the copper-clad ceramic substrate mother board is warped due to the fact that the thermal expansion coefficients of copper and ceramic are not matched and the thicknesses of copper on the two sides are not consistent is solved, and the use requirements of products are met.
本发明公开了一种改善覆铜陶瓷基板母板翘曲的方法；包括陶瓷基板、焊料层、铜箔，所述铜箔通过焊料层钎焊在陶瓷基板两侧，所述陶瓷基板为氧化铝、氮化铝、氮化硅中的一种或多种，本发明对氧化石墨烯进行表面处理，提高界面相容性，加入中空玻璃微珠和二氧化钛，与镍镀液进行混合，在陶瓷基板表面进行镀镍处理，提高陶瓷基板模板的力学性能，在陶瓷基板两侧设计不同尺寸焊料图形，调节两侧铜箔与陶瓷的结合面积，使陶瓷基板在冷却时两侧受到的收缩力一致，解决了铜与陶瓷热膨胀系数不匹配以及两侧铜厚不一致导致的覆铜陶瓷基板母板翘曲的问题，满足产品使用要求。
Method for improving warping of copper-clad ceramic substrate mother board
The invention discloses a method for improving warping of a copper-clad ceramic substrate mother board. Comprising a ceramic substrate, a solder layer and copper foils, the copper foils are brazed on the two sides of the ceramic substrate through the solder layer, the ceramic substrate is one or more of aluminum oxide, aluminum nitride and silicon nitride, graphene oxide is subjected to surface treatment, the interfacial compatibility is improved, hollow glass beads and titanium dioxide are added and mixed with a nickel plating solution, and the nickel plating solution is prepared. Nickel plating treatment is carried out on the surface of the ceramic substrate, the mechanical property of a ceramic substrate template is improved, solder patterns of different sizes are designed on the two sides of the ceramic substrate, and the bonding area of copper foils on the two sides and ceramic is adjusted, so that contraction force borne by the two sides of the ceramic substrate is consistent when the ceramic substrate is cooled; the problem that the copper-clad ceramic substrate mother board is warped due to the fact that the thermal expansion coefficients of copper and ceramic are not matched and the thicknesses of copper on the two sides are not consistent is solved, and the use requirements of products are met.
本发明公开了一种改善覆铜陶瓷基板母板翘曲的方法；包括陶瓷基板、焊料层、铜箔，所述铜箔通过焊料层钎焊在陶瓷基板两侧，所述陶瓷基板为氧化铝、氮化铝、氮化硅中的一种或多种，本发明对氧化石墨烯进行表面处理，提高界面相容性，加入中空玻璃微珠和二氧化钛，与镍镀液进行混合，在陶瓷基板表面进行镀镍处理，提高陶瓷基板模板的力学性能，在陶瓷基板两侧设计不同尺寸焊料图形，调节两侧铜箔与陶瓷的结合面积，使陶瓷基板在冷却时两侧受到的收缩力一致，解决了铜与陶瓷热膨胀系数不匹配以及两侧铜厚不一致导致的覆铜陶瓷基板母板翘曲的问题，满足产品使用要求。
Method for improving warping of copper-clad ceramic substrate mother board
一种改善覆铜陶瓷基板母板翘曲的方法
YU XIAODONG (Autor:in) / YANG KAI (Autor:in) / LIU XIAOHUI (Autor:in)
13.05.2022
Patent
Elektronische Ressource
Chinesisch
Method for controlling warping degree of copper-clad ceramic substrate mother board
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