Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic substrate and preparation method thereof
The invention discloses a ceramic substrate and a preparation method thereof, and relates to the technical field of electronic packaging materials, the ceramic substrate comprises green tapes and adhesion isolating layers which are alternately stacked, and the green tapes are arranged on the surface layer and the bottom layer of the ceramic substrate; the number of layers of the raw ceramic tapes is 2-6; the adhesion isolation layer is formed by laying adhesion isolation powder, the adhesion isolation powder is spherical, and the particle size of the adhesion isolation powder is 5-10 [mu] m. According to the technical scheme, the anti-sticking powder is spherical in shape, regular in shape and good in fluidity; the particle size of the adhesion-isolating powder is controlled to be 5-10 microns, and the adhesion-isolating powder within the particle size range is low in surface activity and not prone to reacting with a green tape; the number of the layers of the green tapes is 2-6, so that the stress of each layer of the green tapes is basically consistent, and the green tapes positioned below are prevented from being overlarge in stress; according to the technical scheme, when displacement occurs due to sintering shrinkage, friction between the green tape and the adhesion isolating powder can be avoided, and therefore the problem that the green tape is prone to being scratched in the sintering process is solved.
本发明公开了一种陶瓷基板及其制备方法，涉及电子封装材料技术领域，其中，陶瓷基板包括交替叠放的生瓷带和隔粘层，且陶瓷基板的表层和底层均为生瓷带；生瓷带的层数为2‑6层；隔粘层通过隔粘粉敷设而成，隔粘粉的形貌为球形，且隔粘粉的粒径为5‑10μm。本发明的技术方案设置隔粘粉的形貌为球形，其形貌规则且流动性好；控制隔粘粉的粒径为5‑10μm，该粒径范围的隔粘粉表面活性低，不易与生瓷带反应；设置生瓷带的层数为2‑6层，可以保证各层生瓷带的受力基本一致，避免位于下方的生瓷带所受压力过大；上述技术方案在烧结收缩发生位移时，均可以避免生瓷带与隔粘粉产生摩擦，从而改善了烧结时易划伤的问题。
Ceramic substrate and preparation method thereof
The invention discloses a ceramic substrate and a preparation method thereof, and relates to the technical field of electronic packaging materials, the ceramic substrate comprises green tapes and adhesion isolating layers which are alternately stacked, and the green tapes are arranged on the surface layer and the bottom layer of the ceramic substrate; the number of layers of the raw ceramic tapes is 2-6; the adhesion isolation layer is formed by laying adhesion isolation powder, the adhesion isolation powder is spherical, and the particle size of the adhesion isolation powder is 5-10 [mu] m. According to the technical scheme, the anti-sticking powder is spherical in shape, regular in shape and good in fluidity; the particle size of the adhesion-isolating powder is controlled to be 5-10 microns, and the adhesion-isolating powder within the particle size range is low in surface activity and not prone to reacting with a green tape; the number of the layers of the green tapes is 2-6, so that the stress of each layer of the green tapes is basically consistent, and the green tapes positioned below are prevented from being overlarge in stress; according to the technical scheme, when displacement occurs due to sintering shrinkage, friction between the green tape and the adhesion isolating powder can be avoided, and therefore the problem that the green tape is prone to being scratched in the sintering process is solved.
本发明公开了一种陶瓷基板及其制备方法，涉及电子封装材料技术领域，其中，陶瓷基板包括交替叠放的生瓷带和隔粘层，且陶瓷基板的表层和底层均为生瓷带；生瓷带的层数为2‑6层；隔粘层通过隔粘粉敷设而成，隔粘粉的形貌为球形，且隔粘粉的粒径为5‑10μm。本发明的技术方案设置隔粘粉的形貌为球形，其形貌规则且流动性好；控制隔粘粉的粒径为5‑10μm，该粒径范围的隔粘粉表面活性低，不易与生瓷带反应；设置生瓷带的层数为2‑6层，可以保证各层生瓷带的受力基本一致，避免位于下方的生瓷带所受压力过大；上述技术方案在烧结收缩发生位移时，均可以避免生瓷带与隔粘粉产生摩擦，从而改善了烧结时易划伤的问题。
Ceramic substrate and preparation method thereof
陶瓷基板及其制备方法
HU CHUANDENG (Autor:in) / ZHANG XIANLI (Autor:in) / LI SHANSHAN (Autor:in)
17.12.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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