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METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES
A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.
METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES
A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.
METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
SUBSTRAT MÉTALLIQUE/CÉRAMIQUE AINSI QUE PROCÉDÉ PERMETTANT DE FABRIQUER UN TEL SUBSTRAT MÉTALLIQUE/CÉRAMIQUE
MEYER ANDREAS (Autor:in) / WEHE CHRISTOPH (Autor:in) / SCHULZ-HARDER JÜRGEN (Autor:in) / SCHMIDT KARSTEN (Autor:in)
08.05.2019
Patent
Elektronische Ressource
Deutsch
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