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    METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES

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    A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.

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    METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES

    New search for: MEYER ANDREAS
    New search for: WEHE CHRISTOPH
    New search for: SCHULZ-HARDER JÜRGEN
    New search for: SCHMIDT KARSTEN

    A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.

    Access

    Download

    METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES

    New search for: MEYER ANDREAS
    New search for: WEHE CHRISTOPH
    New search for: SCHULZ-HARDER JÜRGEN
    New search for: SCHMIDT KARSTEN

    A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.

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    Title:

    METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES

    Additional title:

    METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
    SUBSTRAT MÉTALLIQUE/CÉRAMIQUE AINSI QUE PROCÉDÉ PERMETTANT DE FABRIQUER UN TEL SUBSTRAT MÉTALLIQUE/CÉRAMIQUE

    Contributors:

    MEYER ANDREAS (author) / WEHE CHRISTOPH (author) / SCHULZ-HARDER JÜRGEN (author) / SCHMIDT KARSTEN (author)

    Publication date:

    2019-05-08

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    German

    Classification:

    IPC:  C04B Kalk , LIME / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse

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