Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE
A power module substrate (10) including an insulating substrate (11), a circuit layer (12) formed on one surface of the insulating substrate (11), and a metal layer (13) formed on the other surface of the insulating substrate (11), wherein the circuit layer (12) is composed of copper or a copper alloy, one surface of this circuit layer (12) functions as an installation surface on which an electronic component (3) is installed, the metal layer (13) is formed by bonding an aluminum sheet composed of aluminum or an aluminum alloy, a thickness t 1 of the circuit layer (12) is within a range of 0.1 mm ¤ t 1 ¤ 0.6 mm, a thickness t 2 of the metal layer (13) is within a range of 0.5 mm ¤ t 2 ¤ 6 mm, and the relationship between the thickness t 1 of the circuit layer (12) and the thickness t 2 of the metal layer (13) satisfies t 1 < t 2 .
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE
A power module substrate (10) including an insulating substrate (11), a circuit layer (12) formed on one surface of the insulating substrate (11), and a metal layer (13) formed on the other surface of the insulating substrate (11), wherein the circuit layer (12) is composed of copper or a copper alloy, one surface of this circuit layer (12) functions as an installation surface on which an electronic component (3) is installed, the metal layer (13) is formed by bonding an aluminum sheet composed of aluminum or an aluminum alloy, a thickness t 1 of the circuit layer (12) is within a range of 0.1 mm ¤ t 1 ¤ 0.6 mm, a thickness t 2 of the metal layer (13) is within a range of 0.5 mm ¤ t 2 ¤ 6 mm, and the relationship between the thickness t 1 of the circuit layer (12) and the thickness t 2 of the metal layer (13) satisfies t 1 < t 2 .
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE
LEISTUNGSMODULSUBSTRAT, LEISTUNGSMODULSUBSTRAT MIT KÜHLKÖRPER UND LEISTUNGSMODUL
SUBSTRAT DE MODULE DE PUISSANCE, SUBSTRAT DE MODULE DE PUISSANCE MUNI DE DISSIPATEUR THERMIQUE, ET MODULE DE PUISSANCE
NAGATOMO YOSHIYUKI (Autor:in) / TERASAKI NOBUYUKI (Autor:in) / KUROMITSU YOSHIROU (Autor:in)
09.10.2019
Patent
Elektronische Ressource
Englisch
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