Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
KUROMITSU YOSHIROU (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in) / TERASAKI NOBUYUKI (Autor:in) / SAKAMOTO TOSHIO (Autor:in) / MAKI KAZUNARI (Autor:in) / MORI HIROYUKI (Autor:in) / ARAI ISAO (Autor:in)
23.06.2015
Patent
Elektronische Ressource
Englisch
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