Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE SUBSTRATE WITH COOLER, AND POWER MODULE
A power module substrate with a heatsink includes: a power module substrate 10 provided with a ceramic substrate 11, a circuit layer 12 and a metal layer 13; and a heatsink 18 bonded to the metal layer 13 via a solder layer 17 and composed of copper or a copper alloy. The metal layer 13 is formed by bonding an aluminum plate in which the content of Al is 99.0 to 99.85% by mass to the ceramic substrate 11, and the solder layer 17 is formed of a solid-solubilized-hardening type solder material including Sn as a major component and a solid-solubilized element being solid-solubilized into a matrix of Sn.
POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE SUBSTRATE WITH COOLER, AND POWER MODULE
A power module substrate with a heatsink includes: a power module substrate 10 provided with a ceramic substrate 11, a circuit layer 12 and a metal layer 13; and a heatsink 18 bonded to the metal layer 13 via a solder layer 17 and composed of copper or a copper alloy. The metal layer 13 is formed by bonding an aluminum plate in which the content of Al is 99.0 to 99.85% by mass to the ceramic substrate 11, and the solder layer 17 is formed of a solid-solubilized-hardening type solder material including Sn as a major component and a solid-solubilized element being solid-solubilized into a matrix of Sn.
POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE SUBSTRATE WITH COOLER, AND POWER MODULE
LEISTUNGSMODULSUBSTRAT MIT KÜHLKÖRPER, LEISTUNGSMODULSUBSTRAT MIT KÜHLER UND LEISTUNGSMODUL
SUBSTRAT DE MODULE DE PUISSANCE MUNI DE DISSIPATEUR THERMIQUE, SUBSTRAT DE MODULE DE PUISSANCE MUNI DE REFROIDISSEUR, ET MODULE DE PUISSANCE
NAGATOMO YOSHIYUKI (Autor:in) / KUROMITSU YOSHIROU (Autor:in)
03.08.2022
Patent
Elektronische Ressource
Englisch
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE
| Europäisches Patentamt | 2019
Power module substrate, power module substrate with heat sink, and power module
| Europäisches Patentamt | 2016
| Europäisches Patentamt | 2015