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METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE
A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member (11) and a copper member (12) through an active metal material and a filler metal having a melting point of 710°C or lower, and a heating treatment step of heating the ceramic member (11) and the copper member (12) laminated together.
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE
A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member (11) and a copper member (12) through an active metal material and a filler metal having a melting point of 710°C or lower, and a heating treatment step of heating the ceramic member (11) and the copper member (12) laminated together.
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE
VERFAHREN ZUR HERSTELLUNG EINES VERBUNDETEN KÖRPERS UND VERFAHREN ZUR HERSTELLUNG EINES STROMMODULSUBSTRATS
PROCÉDÉ DE FABRICATION DE CORPS ASSEMBLÉ ET PROCÉDÉ DE FABRICATION DE SUBSTRAT DE MODULE DE PUISSANCE
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
31.01.2018
Patent
Elektronische Ressource
Englisch
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