Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
ASSEMBLY AND POWER-MODULE SUBSTRATE
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu-P-Sn-based brazing filler material and a Ti material, wherein a Cu-Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and a Ti layer which is positioned between the Cu member and the Cu-Sn layer, are formed at a bonded interface between the ceramic member and the Cu member, a first intermetallic compound layer made of Cu and Ti is formed between the Cu member and the Ti layer, and a second intermetallic compound layer containing P is formed between the Cu-Sn layer and the Ti layer.
ASSEMBLY AND POWER-MODULE SUBSTRATE
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu-P-Sn-based brazing filler material and a Ti material, wherein a Cu-Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and a Ti layer which is positioned between the Cu member and the Cu-Sn layer, are formed at a bonded interface between the ceramic member and the Cu member, a first intermetallic compound layer made of Cu and Ti is formed between the Cu member and the Ti layer, and a second intermetallic compound layer containing P is formed between the Cu-Sn layer and the Ti layer.
ASSEMBLY AND POWER-MODULE SUBSTRATE
ANORDNUNG UND STROMMODULSUBSTRAT
ENSEMBLE ET SUBSTRAT DE MODULE DE PUISSANCE
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
17.10.2018
Patent
Elektronische Ressource
Englisch
| Europäisches Patentamt | 2017