Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BONDED BODY, SUBSTRATE FOR POWER MODULES, POWER MODULE AND METHOD FOR PRODUCING BONDED BODY
There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 µm to 3 µm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at% to 15 at%.
BONDED BODY, SUBSTRATE FOR POWER MODULES, POWER MODULE AND METHOD FOR PRODUCING BONDED BODY
There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 µm to 3 µm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at% to 15 at%.
BONDED BODY, SUBSTRATE FOR POWER MODULES, POWER MODULE AND METHOD FOR PRODUCING BONDED BODY
VERBUNDENER KÖRPER, SUBSTRAT FÜR LEISTUNGSMODULE, LEISTUNGSMODUL UND VERFAHREN ZUR HERSTELLUNG EINES VERBUNDENEN KÖRPERS
CORPS LIÉ, SUBSTRAT POUR MODULES DE PUISSANCE, MODULE DE PUISSANCE ET PROCÉDÉ DE PRODUCTION D'UN CORPS LIÉ
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
20.03.2019
Patent
Elektronische Ressource
Englisch
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