Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CIRCUIT BOARD AND METHOD FOR PRODUCING A CIRCUIT BOARD
One aspect relates to a method for producing a circuit board. A copper-containing metal foil 11, 12 is disposed on a copper and oxygen containing coating 21', 22' of a carrier 10 so that the coating adjoins both the metal foil 11, 12 and a ceramic surface 10t, 10b of the carrier. The carrier, the coating and the metal foil are heated to at least a first temperature so that the coating and the metal foil unify, under the formation of a copper and oxygen containing eutectic, to a metallization layer. Subsequently, the carrier and the metallization layer are cooled to temperatures below the first temperature.
CIRCUIT BOARD AND METHOD FOR PRODUCING A CIRCUIT BOARD
One aspect relates to a method for producing a circuit board. A copper-containing metal foil 11, 12 is disposed on a copper and oxygen containing coating 21', 22' of a carrier 10 so that the coating adjoins both the metal foil 11, 12 and a ceramic surface 10t, 10b of the carrier. The carrier, the coating and the metal foil are heated to at least a first temperature so that the coating and the metal foil unify, under the formation of a copper and oxygen containing eutectic, to a metallization layer. Subsequently, the carrier and the metallization layer are cooled to temperatures below the first temperature.
CIRCUIT BOARD AND METHOD FOR PRODUCING A CIRCUIT BOARD
LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE
CARTE DE CIRCUIT IMPRIMÉ ET PROCÉDÉ DE PRODUCTION D'UNE CARTE DE CIRCUIT IMPRIMÉ
ROTH ALEXANDER (Autor:in)
04.04.2018
Patent
Elektronische Ressource
Englisch
CIRCUIT BOARD, AND METHOD FOR PRODUCING CIRCUIT BOARD
| Europäisches Patentamt | 2024
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2021