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Method for producing ceramic circuit board

CHIWATA NOBUHIKO

A method for producing a ceramic circuit board comprising the steps of bonding a metal sheet to a ceramic substrate via a brazing material containing Ag to form a bonded body; etching the bonded metal sheet to form a circuit pattern; and removing an unnecessary brazing material from the substrate provided with the circuit pattern, by etching with an acidic solution comprising carboxylic acid and/or carboxylate and hydrogen peroxide.

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Method for producing ceramic circuit board

CHIWATA NOBUHIKO

A method for producing a ceramic circuit board comprising the steps of bonding a metal sheet to a ceramic substrate via a brazing material containing Ag to form a bonded body; etching the bonded metal sheet to form a circuit pattern; and removing an unnecessary brazing material from the substrate provided with the circuit pattern, by etching with an acidic solution comprising carboxylic acid and/or carboxylate and hydrogen peroxide.

Method for producing ceramic circuit board

CHIWATA NOBUHIKO

A method for producing a ceramic circuit board comprising the steps of bonding a metal sheet to a ceramic substrate via a brazing material containing Ag to form a bonded body; etching the bonded metal sheet to form a circuit pattern; and removing an unnecessary brazing material from the substrate provided with the circuit pattern, by etching with an acidic solution comprising carboxylic acid and/or carboxylate and hydrogen peroxide.

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Titel:

Method for producing ceramic circuit board

Beteiligte:

CHIWATA NOBUHIKO (Autor:in)

Erscheinungsdatum:

16.10.2018

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Englisch

Klassifikation:

IPC: H05K PRINTED CIRCUITS , Gedruckte Schaltungen / C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

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