A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CIRCUIT BOARD AND METHOD FOR PRODUCING A CIRCUIT BOARD
One aspect relates to a method for producing a circuit board. A copper-containing metal foil 11, 12 is disposed on a copper and oxygen containing coating 21', 22' of a carrier 10 so that the coating adjoins both the metal foil 11, 12 and a ceramic surface 10t, 10b of the carrier. The carrier, the coating and the metal foil are heated to at least a first temperature so that the coating and the metal foil unify, under the formation of a copper and oxygen containing eutectic, to a metallization layer. Subsequently, the carrier and the metallization layer are cooled to temperatures below the first temperature.
CIRCUIT BOARD AND METHOD FOR PRODUCING A CIRCUIT BOARD
One aspect relates to a method for producing a circuit board. A copper-containing metal foil 11, 12 is disposed on a copper and oxygen containing coating 21', 22' of a carrier 10 so that the coating adjoins both the metal foil 11, 12 and a ceramic surface 10t, 10b of the carrier. The carrier, the coating and the metal foil are heated to at least a first temperature so that the coating and the metal foil unify, under the formation of a copper and oxygen containing eutectic, to a metallization layer. Subsequently, the carrier and the metallization layer are cooled to temperatures below the first temperature.
CIRCUIT BOARD AND METHOD FOR PRODUCING A CIRCUIT BOARD
LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE
CARTE DE CIRCUIT IMPRIMÉ ET PROCÉDÉ DE PRODUCTION D'UNE CARTE DE CIRCUIT IMPRIMÉ
ROTH ALEXANDER (author)
2018-04-04
Patent
Electronic Resource
English
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021