Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BONDED BODY AND INSULATED CIRCUIT BOARD
A bonded body (10) is formed by bonding a ceramic member (11) formed of an Al-based ceramic and a copper member (12) formed of copper or a copper alloy, in which, in a bonding layer (30) formed between the ceramic member (11) and the copper member (12), a crystalline active metal compound layer (31) formed of a compound including an active metal is formed on a ceramic member (11) side, and, the Al concentration is 0.15 at% or less in a thickness range of 0.5 µm to 3 µm from an interface of the active metal compound layer (31) on a copper member (12) side toward the copper member (12).
BONDED BODY AND INSULATED CIRCUIT BOARD
A bonded body (10) is formed by bonding a ceramic member (11) formed of an Al-based ceramic and a copper member (12) formed of copper or a copper alloy, in which, in a bonding layer (30) formed between the ceramic member (11) and the copper member (12), a crystalline active metal compound layer (31) formed of a compound including an active metal is formed on a ceramic member (11) side, and, the Al concentration is 0.15 at% or less in a thickness range of 0.5 µm to 3 µm from an interface of the active metal compound layer (31) on a copper member (12) side toward the copper member (12).
BONDED BODY AND INSULATED CIRCUIT BOARD
ZUSAMMENGEFÜGTER KÖRPER UND ISOLIERTE LEITERPLATTE
CORPS LIÉ ET CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (Autor:in)
01.06.2022
Patent
Elektronische Ressource
Englisch
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