Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body (10) obtained by bonding copper members (12) and (13) consisting of copper or a copper alloy to a ceramic member (11), where in an edge region E of each of the copper members (12) and (13), an area ratio of each of Ag solid solution parts (12A) and (13A) having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body (10) obtained by bonding copper members (12) and (13) consisting of copper or a copper alloy to a ceramic member (11), where in an edge region E of each of the copper members (12) and (13), an area ratio of each of Ag solid solution parts (12A) and (13A) having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
KUPFER/KERAMIK VERBUNDKÖRPER UND ISOLIERTE LEITERPLATTE
CORPS LIÉ CUIVRE/CÉRAMIQUE ET CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (Autor:in)
05.06.2024
Patent
Elektronische Ressource
Englisch
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