Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BRAZING FILLER MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR PRODUCING BONDED BODY
According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate (12) and a metal plate (13, 15), the brazing material has an endothermic peak within a range of not less than 550 °C and not more than 700 °C in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550 °C and not more than 650 °C in the heating process.
BRAZING FILLER MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR PRODUCING BONDED BODY
According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate (12) and a metal plate (13, 15), the brazing material has an endothermic peak within a range of not less than 550 °C and not more than 700 °C in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550 °C and not more than 650 °C in the heating process.
BRAZING FILLER MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR PRODUCING BONDED BODY
HARTLÖTFÜLLMATERIAL, VERBUNDENER KÖRPER, KERAMISCHE LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINES VERBUNDENEN KÖRPERS
MATÉRIAU D'APPORT DE BRASAGE, CORPS LIÉ, CARTE DE CIRCUIT IMPRIMÉ CÉRAMIQUE ET PROCÉDÉ DE PRODUCTION DE CORPS LIÉ
YONETSU MAKI (Autor:in) / SUENAGA SEIICHI (Autor:in) / FUJISAWA SACHIKO (Autor:in) / SANO TAKASHI (Autor:in)
07.02.2024
Patent
Elektronische Ressource
Englisch
IPC:
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
C22C
Legierungen
,
ALLOYS
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
BRAZING FILLER MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR PRODUCING BONDED BODY
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