Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER CERAMIC BONDED BODY, BRAZING FILLER METAL, AND METHOD FOR PRODUCING COPPER CERAMIC BONDED BODY
To provide a copper ceramic bonded body that has high bonding strength.SOLUTION: Provided is a copper ceramic bonded body that has a copper material 10 made of Cu or a Cu alloy, a ceramic material 20 bonded to the copper material and made of a nitride of Si or Al, and a bonding layer 30 formed on the bonding surface between the copper material and the ceramic material, containing Cu and Mg, and further containing at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er, and in which the shear strength of the bonding layer is 10 MPa or more.SELECTED DRAWING: Figure 1
【課題】高い接合強度を有する銅セラミックス接合体を提供する。【解決手段】ＣｕまたはＣｕ合金からなる銅材１０と、銅材に接合され、ＳｉまたはＡｌの窒化物からなるセラミックス材２０と、銅材とセラミックス材との接合面に形成され、Ｃｕと、Ｍｇと、を含み、Ｔｉ，Ｚｒ，Ｈｆ，Ｖ，Ｎｂ，Ｔａ，Ｃｒ，Ｍｏ，Ｗ，Ｃａ，Ｙ，Ｃｅ，Ｌａ，Ｓｍ，Ｙｂ，Ｎｄ，Ｇｄ，Ｅｒからなる群より選択される少なくとも一種の活性金属元素をさらに含む接合層３０と、を有し、接合層のせん断強度が１０ＭＰａ以上である。【選択図】図１
COPPER CERAMIC BONDED BODY, BRAZING FILLER METAL, AND METHOD FOR PRODUCING COPPER CERAMIC BONDED BODY
To provide a copper ceramic bonded body that has high bonding strength.SOLUTION: Provided is a copper ceramic bonded body that has a copper material 10 made of Cu or a Cu alloy, a ceramic material 20 bonded to the copper material and made of a nitride of Si or Al, and a bonding layer 30 formed on the bonding surface between the copper material and the ceramic material, containing Cu and Mg, and further containing at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er, and in which the shear strength of the bonding layer is 10 MPa or more.SELECTED DRAWING: Figure 1
【課題】高い接合強度を有する銅セラミックス接合体を提供する。【解決手段】ＣｕまたはＣｕ合金からなる銅材１０と、銅材に接合され、ＳｉまたはＡｌの窒化物からなるセラミックス材２０と、銅材とセラミックス材との接合面に形成され、Ｃｕと、Ｍｇと、を含み、Ｔｉ，Ｚｒ，Ｈｆ，Ｖ，Ｎｂ，Ｔａ，Ｃｒ，Ｍｏ，Ｗ，Ｃａ，Ｙ，Ｃｅ，Ｌａ，Ｓｍ，Ｙｂ，Ｎｄ，Ｇｄ，Ｅｒからなる群より選択される少なくとも一種の活性金属元素をさらに含む接合層３０と、を有し、接合層のせん断強度が１０ＭＰａ以上である。【選択図】図１
COPPER CERAMIC BONDED BODY, BRAZING FILLER METAL, AND METHOD FOR PRODUCING COPPER CERAMIC BONDED BODY
銅セラミックス接合体、ろう材、および、銅セラミックス接合体の製造方法
NOKAWA GENYA (Autor:in) / TAKANO SHUN (Autor:in) / OKISHIRO KENJI (Autor:in) / OKAMOTO ATSUSHI (Autor:in)
05.10.2023
Patent
Elektronische Ressource
Japanisch
IPC:
C04B
Kalk
,
LIME
/
B22F
Verarbeiten von Metallpulver
,
WORKING METALLIC POWDER
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
/
C22C
Legierungen
,
ALLOYS
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