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COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

SAKURAI AKIRA / TERASAKI NOBUYUKI

This copper/ceramic bonded body (10) includes a copper member (12,13) consisting of copper or a copper alloy and a ceramic member (11), wherein the copper member (12,13) is bonded to the ceramic member (11), an active metal compound layer (21) consisting of an active metal compound is formed on a side of the ceramic member (11) at a bonded interface between the ceramic member (11) and the copper member (12,13), microcracks (25) that extend from the bonded interface toward an inner side of the ceramic member (11) are present in the ceramic member (11), and at least a part of the microcracks (25) are filled with the active metal compound.

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COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

SAKURAI AKIRA / TERASAKI NOBUYUKI

This copper/ceramic bonded body (10) includes a copper member (12,13) consisting of copper or a copper alloy and a ceramic member (11), wherein the copper member (12,13) is bonded to the ceramic member (11), an active metal compound layer (21) consisting of an active metal compound is formed on a side of the ceramic member (11) at a bonded interface between the ceramic member (11) and the copper member (12,13), microcracks (25) that extend from the bonded interface toward an inner side of the ceramic member (11) are present in the ceramic member (11), and at least a part of the microcracks (25) are filled with the active metal compound.

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

SAKURAI AKIRA / TERASAKI NOBUYUKI

This copper/ceramic bonded body (10) includes a copper member (12,13) consisting of copper or a copper alloy and a ceramic member (11), wherein the copper member (12,13) is bonded to the ceramic member (11), an active metal compound layer (21) consisting of an active metal compound is formed on a side of the ceramic member (11) at a bonded interface between the ceramic member (11) and the copper member (12,13), microcracks (25) that extend from the bonded interface toward an inner side of the ceramic member (11) are present in the ceramic member (11), and at least a part of the microcracks (25) are filled with the active metal compound.

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Titel:

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

Weitere Titelangaben:

KUPFER/KERAMIK VERBUNDKÖRPER UND ISOLIERTE LEITERPLATTE
CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE ET CARTE DE CIRCUIT IMPRIMÉ ISOLÉE

Beteiligte:

SAKURAI AKIRA (Autor:in) / TERASAKI NOBUYUKI (Autor:in)

Erscheinungsdatum:

16.10.2024

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Englisch

Klassifikation:

IPC: H05K PRINTED CIRCUITS , Gedruckte Schaltungen / C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

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