COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD: Fid-Bau Portal

COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD

TERASAKI NOBUYUKI

To provide a copper/ceramic joined body that can suppress the occurrence of crack in the ceramic member even when a severe thermal cycle is applied, and has excellent thermal cycle reliability.SOLUTION: Provided is a copper/ceramic joined body 10 which is formed by joining copper members 12 and 13 made of copper or a copper alloy, and a ceramic member 11 made of silicon nitride, and in which an active metal nitride layer 21 is formed on the ceramic member 11 side of the copper member 12, an area ratio of the active metal compound including Si and the active metal in a region of 10 μm from the active metal nitride layer 21 to the copper member 12 side is 10% or less, and a ratio PA/PB between an area ratio PA of the active metal compound in a peripheral region A of the copper member 12 and an area ratio PB of the active metal compound in a central region B of the copper member 12 is within the range of 0.7 or more to 1.4 or less.SELECTED DRAWING: Figure 2

【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、窒化ケイ素からなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、銅部材１２のうちセラミックス部材１１側には、活性金属窒化物層２１が形成されており、活性金属窒化物層２１から銅部材１２側へ１０μｍの領域におけるＳｉと活性金属とを含む活性金属化合物の面積率が１０％以下とされており、銅部材１２の周縁部領域Ａにおける前記活性金属化合物の面積率ＰＡと銅部材１２の中央部領域Ｂにおける前記活性金属化合物の面積率ＰＢとの比ＰＡ／ＰＢが、０．７以上１．４以下の範囲内とされている。【選択図】図２

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