Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
MANUFACTURING METHOD OF INSULATED CIRCUIT BOARD AND ITS INSULATED CIRCUIT BOARD
To provide an insulated circuit board which removes wax stains and has good solder wettability and the like.SOLUTION: A manufacturing method of an insulated circuit board includes a joining step of joining a ceramic substrate and a copper plate made of copper or a copper alloy via a brazing material to form a copper layer on the surface of the ceramic substrate, a primary cleaning step of cleaning the surface of the copper layer with an aqueous solution containing iron chloride or copper chloride after the joining step, a secondary cleaning step of cleaning the surface of the copper layer with an aqueous solution containing one or more of chlorides other than iron chloride and copper chloride, ammonia, cyanide, and thiosulfate after the primary cleaning step, and a tertiary cleaning step of performing the cleaning with an aqueous solution containing any one or more of sulfuric acid, persulfate, and a mixed solution of sulfuric acid and hydrogen peroxide after the secondary cleaning step.SELECTED DRAWING: Figure 1
【課題】ろう染みを除去してはんだ濡れ性等の良好な絶縁回路基板を提供する。【解決手段】セラミックス基板と銅又は銅合金からなる銅板とをろう材を介して接合してセラミックス基板の表面に銅層を形成する接合工程と、接合工程後に銅層の表面を塩化鉄又は塩化銅を含む水溶液によって洗浄する一次洗浄工程と、該一次洗浄工程後に銅層の表面を、塩化鉄及び塩化銅以外の塩化物、アンモニア、シアン化物、チオ硫酸塩のいずれか一つ以上を含む水溶液で洗浄する二次洗浄工程と、二次洗浄工程の後に、硫酸、過硫酸塩、硫酸と過酸化水素の混合液のいずれか一つ以上を含む水溶液で洗浄する三次洗浄工程とを有する。【選択図】 図１
MANUFACTURING METHOD OF INSULATED CIRCUIT BOARD AND ITS INSULATED CIRCUIT BOARD
To provide an insulated circuit board which removes wax stains and has good solder wettability and the like.SOLUTION: A manufacturing method of an insulated circuit board includes a joining step of joining a ceramic substrate and a copper plate made of copper or a copper alloy via a brazing material to form a copper layer on the surface of the ceramic substrate, a primary cleaning step of cleaning the surface of the copper layer with an aqueous solution containing iron chloride or copper chloride after the joining step, a secondary cleaning step of cleaning the surface of the copper layer with an aqueous solution containing one or more of chlorides other than iron chloride and copper chloride, ammonia, cyanide, and thiosulfate after the primary cleaning step, and a tertiary cleaning step of performing the cleaning with an aqueous solution containing any one or more of sulfuric acid, persulfate, and a mixed solution of sulfuric acid and hydrogen peroxide after the secondary cleaning step.SELECTED DRAWING: Figure 1
【課題】ろう染みを除去してはんだ濡れ性等の良好な絶縁回路基板を提供する。【解決手段】セラミックス基板と銅又は銅合金からなる銅板とをろう材を介して接合してセラミックス基板の表面に銅層を形成する接合工程と、接合工程後に銅層の表面を塩化鉄又は塩化銅を含む水溶液によって洗浄する一次洗浄工程と、該一次洗浄工程後に銅層の表面を、塩化鉄及び塩化銅以外の塩化物、アンモニア、シアン化物、チオ硫酸塩のいずれか一つ以上を含む水溶液で洗浄する二次洗浄工程と、二次洗浄工程の後に、硫酸、過硫酸塩、硫酸と過酸化水素の混合液のいずれか一つ以上を含む水溶液で洗浄する三次洗浄工程とを有する。【選択図】 図１
MANUFACTURING METHOD OF INSULATED CIRCUIT BOARD AND ITS INSULATED CIRCUIT BOARD
絶縁回路基板の製造方法及びその絶縁回路基板
NISHIKAWA MASATO (Autor:in)
01.10.2020
Patent
Elektronische Ressource
Japanisch
METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, AND JOINED BODY FOR INSULATED CIRCUIT BOARD
| Europäisches Patentamt | 2023
| Europäisches Patentamt | 2021