Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
INSULATED CIRCUIT BOARD
Provided is an insulated circuit board including a ceramic substrate, a circuit layer, and a metal layer that is bonded to the other surface of the ceramic substrate, the circuit layer and the metal layer are made of copper or a copper alloy, the circuit layer is formed of a plurality of punched sheets bonded to the ceramic substrate at an interval, the thickness of the circuit layer is 0.4 mm or more and 2.0 mm or less, when the bonding area of the circuit layer is represented by S1, and the bonding area of the metal layer is represented by S2, the area ratio S1/S2 is 0.5 or more and 0.8 or less, and, when the thickness of the circuit layer is represented by T1, and the thickness of the metal layer is represented by T2, the thickness ratio T1/T2 is 1.2 or more and 1.7 or less.
INSULATED CIRCUIT BOARD
Provided is an insulated circuit board including a ceramic substrate, a circuit layer, and a metal layer that is bonded to the other surface of the ceramic substrate, the circuit layer and the metal layer are made of copper or a copper alloy, the circuit layer is formed of a plurality of punched sheets bonded to the ceramic substrate at an interval, the thickness of the circuit layer is 0.4 mm or more and 2.0 mm or less, when the bonding area of the circuit layer is represented by S1, and the bonding area of the metal layer is represented by S2, the area ratio S1/S2 is 0.5 or more and 0.8 or less, and, when the thickness of the circuit layer is represented by T1, and the thickness of the metal layer is represented by T2, the thickness ratio T1/T2 is 1.2 or more and 1.7 or less.
INSULATED CIRCUIT BOARD
KITAHARA TAKESHI (Autor:in) / OOHIRAKI TOMOYA (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
31.12.2020
Patent
Elektronische Ressource
Englisch
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