Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SUPPORT MEMBER, SUBSTRATE HOLDING MEMBER, AND MANUFACTURING METHOD THEREOF
To provide a support member, a substrate holding member, and a manufacturing method thereof which do not cause stress problems after bonding and can adjust the symmetry of the temperature distribution of a substrate by adjusting the heat insulating properties of the support member.SOLUTION: A support member 100 is formed in a cylindrical shape from a ceramic sintered body containing AlN as a main component, and the support member 100 is composed of a first region 101 and a second region 102, the thermal conductivity of the first region 101 at 25°C is 100 W/mK or more, and the thermal conductivity of the second region 102 at 25°C is 80 W/mK or less.SELECTED DRAWING: Figure 1
【課題】接合後に応力の不具合が生じず、かつ支持部材の断熱性を調整して基板の温度分布の対称性を調整することができる支持部材、基板保持部材、およびその製造方法を提供する。【解決手段】支持部材１００であって、前記支持部材１００は、ＡｌＮを主成分とするセラミックス焼結体により円筒状に形成され、前記支持部材１００は、第１の領域１０１および第２の領域１０２で構成され、前記第１の領域１０１の２５℃における熱伝導率は１００Ｗ／ｍＫ以上であり、前記第２の領域１０２の２５℃における熱伝導率は８０Ｗ／ｍＫ以下である。【選択図】図１
SUPPORT MEMBER, SUBSTRATE HOLDING MEMBER, AND MANUFACTURING METHOD THEREOF
To provide a support member, a substrate holding member, and a manufacturing method thereof which do not cause stress problems after bonding and can adjust the symmetry of the temperature distribution of a substrate by adjusting the heat insulating properties of the support member.SOLUTION: A support member 100 is formed in a cylindrical shape from a ceramic sintered body containing AlN as a main component, and the support member 100 is composed of a first region 101 and a second region 102, the thermal conductivity of the first region 101 at 25°C is 100 W/mK or more, and the thermal conductivity of the second region 102 at 25°C is 80 W/mK or less.SELECTED DRAWING: Figure 1
【課題】接合後に応力の不具合が生じず、かつ支持部材の断熱性を調整して基板の温度分布の対称性を調整することができる支持部材、基板保持部材、およびその製造方法を提供する。【解決手段】支持部材１００であって、前記支持部材１００は、ＡｌＮを主成分とするセラミックス焼結体により円筒状に形成され、前記支持部材１００は、第１の領域１０１および第２の領域１０２で構成され、前記第１の領域１０１の２５℃における熱伝導率は１００Ｗ／ｍＫ以上であり、前記第２の領域１０２の２５℃における熱伝導率は８０Ｗ／ｍＫ以下である。【選択図】図１
SUPPORT MEMBER, SUBSTRATE HOLDING MEMBER, AND MANUFACTURING METHOD THEREOF
支持部材、基板保持部材、およびその製造方法
HINO MAKOTO (Autor:in)
14.10.2022
Patent
Elektronische Ressource
Japanisch
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