Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
WALL SURFACE TREATMENT DEVICE AND WALL SURFACE TREATMENT METHOD OF ASSEMBLY TYPE BUILDING
To provide a wall surface treatment device and a wall surface treatment method of an assembly type building.SOLUTION: A wall surface treatment device and a wall surface treatment method of an assembly type building are a device for subjecting a wall body that is an assembly type building installed on the foundation to wall surface treatment and a method for the same, wherein the device is composed of a power mechanism, a wall surface treatment mechanism which is connected to the power mechanism and obtains power from the power mechanism, and forms a groove on each connection surface of wall bodies, a grooving mechanism for forming a fan-shaped groove on each of the connection surfaces of the wall bodies, and a connection mechanism which remains in the fan-shaped groove and serves as a reinforcement material, and the method enhances connection strength of wall bodies and performs wall surface treatment of filling a gap between the wall bodies with a filling member by using the device.SELECTED DRAWING: Figure 1
【課題】本発明は、組立式建築物の壁面処理装置及び壁面処理方法を提供する。【解決手段】本発明にかかる組立式建築物の壁面処理装置及び壁面処理方法は、基礎上に設置する組立式建築物である壁体の壁面処理を行う装置及びその方法であって、当該装置は、動力機構と、動力機構に接続して動力機構から動力を得て、壁体と壁体の各連結面に溝を形成する壁面処理機構と、壁体と壁体の各連結面に扇状の溝を形成する溝加工機構と、扇状の溝に残地され、補強材の役割を果たす連結機構と、からなり、当該方法は、これらの装置を使って、壁体同士の連結強度を高め、壁体の隙間に充填部材を埋め込む壁面処理を行うことを特徴とする。【選択図】図１
WALL SURFACE TREATMENT DEVICE AND WALL SURFACE TREATMENT METHOD OF ASSEMBLY TYPE BUILDING
To provide a wall surface treatment device and a wall surface treatment method of an assembly type building.SOLUTION: A wall surface treatment device and a wall surface treatment method of an assembly type building are a device for subjecting a wall body that is an assembly type building installed on the foundation to wall surface treatment and a method for the same, wherein the device is composed of a power mechanism, a wall surface treatment mechanism which is connected to the power mechanism and obtains power from the power mechanism, and forms a groove on each connection surface of wall bodies, a grooving mechanism for forming a fan-shaped groove on each of the connection surfaces of the wall bodies, and a connection mechanism which remains in the fan-shaped groove and serves as a reinforcement material, and the method enhances connection strength of wall bodies and performs wall surface treatment of filling a gap between the wall bodies with a filling member by using the device.SELECTED DRAWING: Figure 1
【課題】本発明は、組立式建築物の壁面処理装置及び壁面処理方法を提供する。【解決手段】本発明にかかる組立式建築物の壁面処理装置及び壁面処理方法は、基礎上に設置する組立式建築物である壁体の壁面処理を行う装置及びその方法であって、当該装置は、動力機構と、動力機構に接続して動力機構から動力を得て、壁体と壁体の各連結面に溝を形成する壁面処理機構と、壁体と壁体の各連結面に扇状の溝を形成する溝加工機構と、扇状の溝に残地され、補強材の役割を果たす連結機構と、からなり、当該方法は、これらの装置を使って、壁体同士の連結強度を高め、壁体の隙間に充填部材を埋め込む壁面処理を行うことを特徴とする。【選択図】図１
WALL SURFACE TREATMENT DEVICE AND WALL SURFACE TREATMENT METHOD OF ASSEMBLY TYPE BUILDING
組立式建築物の壁面処理装置及び壁面処理方法
CHEN CHUNLAI (Autor:in) / LOU KE (Autor:in) / WANG TING (Autor:in) / YU JIANYING (Autor:in) / WANG BOCHENG (Autor:in)
18.10.2024
Patent
Elektronische Ressource
Japanisch
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