METHOD FOR METALIZING PLATED-THROUGH HOLES: Fid-Bau Portal

METHOD FOR METALIZING PLATED-THROUGH HOLES

본 발명은 인쇄 회로판들 내에 도금 관통 홀들을 생성하기 위한 방법 및 이러한 방식으로 생생된 인쇄 회로판들에 관한 것이다.

A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

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METHOD FOR METALIZING PLATED-THROUGH HOLES

Abstract

본 발명은 인쇄 회로판들 내에 도금 관통 홀들을 생성하기 위한 방법 및 이러한 방식으로 생생된 인쇄 회로판들에 관한 것이다.

A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

METHOD FOR METALIZING PLATED-THROUGH HOLES

Abstract

본 발명은 인쇄 회로판들 내에 도금 관통 홀들을 생성하기 위한 방법 및 이러한 방식으로 생생된 인쇄 회로판들에 관한 것이다.

A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

Zugriff

Download

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Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

METHOD FOR METALIZING PLATED-THROUGH HOLES

Weitere Titelangaben:

관통 홀을 금속 피복하는 방법

Erscheinungsdatum:

14.04.2020

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Koreanisch

Klassifikation:

IPC: C04B Kalk , LIME / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / H01B CABLES , Kabel

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