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METHOD FOR METALIZING PLATED-THROUGH HOLES
본 발명은 인쇄 회로판들 내에 도금 관통 홀들을 생성하기 위한 방법 및 이러한 방식으로 생생된 인쇄 회로판들에 관한 것이다.
A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.
METHOD FOR METALIZING PLATED-THROUGH HOLES
본 발명은 인쇄 회로판들 내에 도금 관통 홀들을 생성하기 위한 방법 및 이러한 방식으로 생생된 인쇄 회로판들에 관한 것이다.
A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.
CERAMIC METALIZING SUBSTRATE AND MANUFACTURING METHOD THEREOF
European Patent Office | 2019
|METALIZING CRUCIBLE DEVICE WITH IMPROVED SEALING SUTRUCTURE
European Patent Office | 2016
|Metalizing crucible device with improved sealing sutructure
European Patent Office | 2016