Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CHIP SCATTERING APPARATUS AND MANUFACTURING SYSTEM FOR FLOORING
The present invention provides a chip scattering device and a manufacturing system for flooring material, including the same. The chip scattering device includes: a hopper member including a storage space storing chips scattered onto the surface of a plate-shaped base unit; a plate-shaped induction plate member receiving the chips falling from the hopper member and installed in the lower part of the hopper member; a cylindrical scattering roll member installed to be adjacent to the induction plate member and rotating in a direction, wherein multiple chip accommodation grooves are formed to be concave on the outer circumference and the scattering roll member scatters the chips onto the base unit by dropping the chips accommodated in the chip accommodation groove by rotation after the chips moved by the induction plate member are accommodated in the chip accommodation groove; and a control roll member rotating by being installed to be adjacent to the scattering roll member so that the chips are evenly scattered onto the base unit by the scattering roll member, wherein the control roll member also includes multiple brushes on the outer circumference, and the multiple brushes remove the chips exceeding the chip accommodation grove from the scattering roll member by coming in contact with the outer circumference of the scattering roll member. The chip scattering device has improved sliding properties, improved wear properties, and high decorative properties by evenly scattering the chips onto a flooring material.
본 발명은 칩 산포장치와 이를 구비한 바닥재 제조시스템을 제공한다. 상기 칩 산포장치는, 판 형의 기재부의 표면에 산포되는 칩이 저장되는 저장공간이 구비된, 호퍼부재와, 상기 호퍼부재의 하부에 구비되어, 상기 호퍼부재로부터 낙하하는 상기 칩을 공급받는, 판 형의 유도판부재와, 상기 유도판부재에 접하도록 위치하고, 일방향으로 회전하며, 외주면에 복수의 칩수용홈이 요입 형성되어, 상기 유도판부재에 의해 이동된 상기 칩이 상기 칩수용홈에 수용된 후, 회전에 의해 상기 칩수용홈에 수용된 상기 칩을 낙하시켜서 상기 기재부에 산포시키는, 원통형의 산포롤부재와, 상기 산포롤부재에 의해 상기 기재부에 칩이 균일하게 산포되도록, 상기 산포롤부재와 인접하게 설치되어 회전하고, 상기 산포롤부재의 외주면에 접촉되어 상기 칩수용홈을 초과하는 칩을 상기 산포롤부재로부터 제거하는 복수의 브러시가 외주면에 구비되는, 조절롤부재를 포함한다.
CHIP SCATTERING APPARATUS AND MANUFACTURING SYSTEM FOR FLOORING
The present invention provides a chip scattering device and a manufacturing system for flooring material, including the same. The chip scattering device includes: a hopper member including a storage space storing chips scattered onto the surface of a plate-shaped base unit; a plate-shaped induction plate member receiving the chips falling from the hopper member and installed in the lower part of the hopper member; a cylindrical scattering roll member installed to be adjacent to the induction plate member and rotating in a direction, wherein multiple chip accommodation grooves are formed to be concave on the outer circumference and the scattering roll member scatters the chips onto the base unit by dropping the chips accommodated in the chip accommodation groove by rotation after the chips moved by the induction plate member are accommodated in the chip accommodation groove; and a control roll member rotating by being installed to be adjacent to the scattering roll member so that the chips are evenly scattered onto the base unit by the scattering roll member, wherein the control roll member also includes multiple brushes on the outer circumference, and the multiple brushes remove the chips exceeding the chip accommodation grove from the scattering roll member by coming in contact with the outer circumference of the scattering roll member. The chip scattering device has improved sliding properties, improved wear properties, and high decorative properties by evenly scattering the chips onto a flooring material.
본 발명은 칩 산포장치와 이를 구비한 바닥재 제조시스템을 제공한다. 상기 칩 산포장치는, 판 형의 기재부의 표면에 산포되는 칩이 저장되는 저장공간이 구비된, 호퍼부재와, 상기 호퍼부재의 하부에 구비되어, 상기 호퍼부재로부터 낙하하는 상기 칩을 공급받는, 판 형의 유도판부재와, 상기 유도판부재에 접하도록 위치하고, 일방향으로 회전하며, 외주면에 복수의 칩수용홈이 요입 형성되어, 상기 유도판부재에 의해 이동된 상기 칩이 상기 칩수용홈에 수용된 후, 회전에 의해 상기 칩수용홈에 수용된 상기 칩을 낙하시켜서 상기 기재부에 산포시키는, 원통형의 산포롤부재와, 상기 산포롤부재에 의해 상기 기재부에 칩이 균일하게 산포되도록, 상기 산포롤부재와 인접하게 설치되어 회전하고, 상기 산포롤부재의 외주면에 접촉되어 상기 칩수용홈을 초과하는 칩을 상기 산포롤부재로부터 제거하는 복수의 브러시가 외주면에 구비되는, 조절롤부재를 포함한다.
CHIP SCATTERING APPARATUS AND MANUFACTURING SYSTEM FOR FLOORING
칩 산포장치와 이를 구비한 바닥재 제조시스템
CHANG CHONG DAE (Autor:in) / LEE SANG HYUN (Autor:in) / KIM KI TAE (Autor:in) / BAEK HYEON JONG (Autor:in)
08.04.2019
Patent
Elektronische Ressource
Koreanisch
IPC:
E01C
Bau von Straßen, Sportplätzen oder dgl., Decken dafür
,
CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE
CHIP SCATTERING APPARATUS AND MANUFACTURING SYSTEM FOR FLOORING
Europäisches Patentamt | 2020
CHIP STACKING APPARATUS AND MANUFACTURING SYSTEM FOR FLOORING
Europäisches Patentamt | 2019
CHIP STACKING APPARATUS AND MANUFACTURING SYSTEM FOR FLOORING
| Europäisches Patentamt | 2019