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    Method for manufacturing bonded body and method for manufacturing power-module substrate

    New search for: TERASAKI NOBUYUKI
    New search for: NAGATOMO YOSHIYUKI

    A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

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    Method for manufacturing bonded body and method for manufacturing power-module substrate

    New search for: TERASAKI NOBUYUKI
    New search for: NAGATOMO YOSHIYUKI

    A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

    Access

    Download

    Method for manufacturing bonded body and method for manufacturing power-module substrate

    New search for: TERASAKI NOBUYUKI
    New search for: NAGATOMO YOSHIYUKI

    A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

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    Download

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    Document information
    Similar titles

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    Document information
    Title:

    Method for manufacturing bonded body and method for manufacturing power-module substrate

    Contributors:

    TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)

    Publication date:

    2019-02-05

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / C04B Kalk , LIME

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